Passive/Active Defect Monitoring Inverse Analysis Method Using Flexible Piezoelectric Smart Layer with Probe Matrix

点击翻译按钮获取中文摘要

For assuring integrity of structures, the passive/active defect monitoring inverse analysis method was proposed using flexible piezoelectric smart layer with probe matrix. By the passive electric potential CT (computed tomography) method, which used electric potential appearing passively on piezoelectric film, a part-through three-dimensional crack was identified successfully. The advantage of the use of several piezoelectric films was demonstrated. In the active pulse-echo method, echo emitted actively at a probe was received at several probes. From the time-of-flight of the echo for several combinations of emitting and receiving probes, the crack was identified. When echo interference was observed for echo emitted at two probes, crack identification was made successfully from the difference of emitting time of the echo. The effect of the simultaneous use of the passive and the active methods was identified.