Development of low damage high rate sputter-deposition process for the fabrication of OLED

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In the fabrication of an organic light emitting diode (OLED), the deposition of top electrode films by using the sputtering technique led to a significant increase in its operating voltage. Therefore, the development of a sputter-deposition process without such unwanted phenomena is greatly desired. In this work, we have proposed low damage facing target sputtering (FTS) method for the deposition of the top electrode films with significantly low levels of damage and tried to confirm the effectiveness of the sputter-deposition method. As a results, it was clarified that the low damage FTS was useful to improve the operating characteristics of the OLED, although a complete suppression of the incidence of high energy secondary electrons to the substrate was necessary. In addition, optimization of the sputtering conditions such as sputtering gas pressure and sputtering current were also effective to improve the operating characteristics of the OLED.