ゲルマニウム/ひずみーシリコンヘテロ接合を用いたトンネル電界効果トランジスタ
ゲルマニウム/ひずみーシリコンヘテロ接合を用いたトンネル電界効果トランジスタ
批准号:
14J06072
负责人:
金 ミンス
金额:
$1.39万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for JSPS Fellows
财政年份:
2014
资助国家:
日本
项目状态:
已结题
起止时间:
2014-04-25 至 2016-03-31
中文摘要
1. 背向偏置效应:在较宽的中间ID区域内,尽管Ioff增加,但离子显著增加,SS显著降低。负VB是由于隧道电流受到抑制,导致SSmin降低。结果表明,从锗源到硅沟道后界面可产生隧道电流,特别是垂直隧道电流,电流可通过硅沟道后界面附近形成的反转层。由于隧穿效率高,垂直隧穿电流比横向隧穿电流表现出更高的漏极,这些垂直隧穿的电子在sSi沟道的ge源下方和近后界面处形成n源。然而,sSi通道主要由VG控制,因为正极绝缘子的EOT比BOX薄得多。因此,这种正VB诱导的垂直隧道效应对提高Ge/sSi TFET的性能具有很大的前景,并且可以有效地利用VB与VG同步应用于Fin FET、纳米线等多栅极结构中来提高TFET的性能。实验证实,改进后的漏极掺杂浓度为1018 cm-3,适合进一步提高性能。在本研究中,通过将栅极介电材料Al2O3改为HfO2, EOT从2.5 nm缩放到1.5 nm。结果表明,越薄的EOT器件具有越高的电流。然而,由于Ge和Si的大Dit, hfo2器件的泄漏电流增加。
英文摘要
1. Back biasing effectPositive VB yields a significant increase in Ion and decrease in SS in a wide range of middle ID region in spite of the increase in Ioff. Negative VB is attributable to the suppressed tunneling current, resulting in lower SSmin. It is revealed that tunneling current, especially vertical tunneling can occur from Ge-source to back interface of sSi-channel and current can flow through the inversion layer formed near back interface of sSi-channel. This vertical tunneling current shows high drain on current than lateral tunneling current because of high tunneling efficiency and these vertically tunneled electrons make an n-source at beneath the Ge-source and near back interface of sSi channel. However, the sSi channel is mainly controlled by VG because of much thinner EOT of front gate insulators than that of BOX. Consequently, this positive VB-induced vertical tunneling is greatly promising to improve the performance of Ge/sSi TFETs and it can be effectively utilized for improving the TFET performance by applying the synchronized VB with VG in multi-gate structure such as Fin FET, nanowire and so on.2. Drain engineeringIt is experimentally confirmed that the modified drain doping concentration of 1018 cm-3 is suitable for further performance improvement.3. EOT scalingIn this study the EOT was scaling from 2.5 nm to 1.5 nm by changing the gate dielectric material from Al2O3 to HfO2. It is found that higher on current is obtained in thinner EOT device. However, the leakage current increases in HfO2-device because of large Dit with Ge and Si.
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DOI:
10.1109/ted.2014.2371038
发表时间:
2015
期刊:
IEEE Transactions on Electron Devices
影响因子:
3.1
作者:
[Minsoo Kim;Y. Wakabayashi;M. Yokoyama;R. Nakane;M. Takenaka;S. Takagi]
通讯作者:
Minsoo Kim;Y. Wakabayashi;M. Yokoyama;R. Nakane;M. Takenaka;S. Takagi
Ge/Si Hetero-Junction TFETs with In-situ Boron-Doped Ge-Source
具有原位硼掺杂 Ge 源的 Ge/Si 异质结 TFET
DOI:
--
发表时间:
2014
期刊:
影响因子:
--
作者:
[Minsoo Kim, Yuki K. Wakabayashi, Masafumi Yokoyama, Ryosho Nakane, Mitsuru Takenaka, and Shinichi Takagi]
通讯作者:
and Shinichi Takagi
Effects of strain, interface states and back bias on electrical characteristics of Ge-source UTB strained-SOI tunnel FETs
应变、界面态和反向偏压对 Ge 源 UTB 应变 SOI 隧道 FET 电特性的影响
DOI:
--
发表时间:
2015
期刊:
影响因子:
--
作者:
[M. -S. Kim, Y. -H Kim, M. Yokoyama, R. Nakane, S. -H. Kim, M. Takenaka and S. Takagi, Minsoo Kim]
通讯作者:
Minsoo Kim
極めて低い消費電力で動くトンネル電界効果トランジスターを開発
开发功耗极低的隧道场效应晶体管
DOI:
--
发表时间:
期刊:
影响因子:
--
作者:
[]
通讯作者:
DOI:
--
发表时间:
2014
期刊:
影响因子:
--
作者:
[Minsoo Kim;Y. Wakabayashi;R. Nakane;M. Yokoyama;M. Takenaka;Takagi Shinichi]
通讯作者:
Minsoo Kim;Y. Wakabayashi;R. Nakane;M. Yokoyama;M. Takenaka;Takagi Shinichi
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