A novel heat transfer enhancement method: Combination of Nano-encapsulated PCM and metal foam

我们做了广泛的文献综述，并仔细研究了这一领域的许多文章。为了求解控制方程，在COMSOL和OPENFOAM软件中分别制作了两个求解器。对控制方程进行了无因次化处理，得到了控制参数。研究了它们对最大化换热和最小化压降的影响。以矩形截面微通道为研究对象。他们发现了许多有趣的结果，这就是为什么有关这些结果的摘要被发送给一个国际会议的原因。设计了实验装置，订购了所需的设备和材料，如微通道、纳米封装PCM等。开始建立实验装置。

A wide literature review was done and many articles in this field was studied carefully. In order to solve the governing equations, two solvers were made in the COMSOL and OPENFOAM software. The governing equations were made dimensionless and the governing parameters were obtained. The effects of them on maximizing the heat transfer and minimization of pressure drop were investigated. The study was done for micro channels with rectangular cross-section. Many interesting results were found, and that’s why an abstract relating to the obtained results was sent to an international conference. An experimental device was designed and necessary equipment and materials such as microchannel, nano-encapsulated PCM etc. were ordered and received. Establishment of the experimental setup was started.