PATTERN: Next generation ultra-high-speed microwave Photonic integrATed circuiTs using advancE hybRid iNtegration

模式：采用先进混合集成的下一代超高速微波光子集成电路

• 批准号: 10044974
• 金额: $ 75.14万
• 依托单位: UNIVERSITY COLLEGE LONDON
• 依托单位国家: 英国
• 项目类别: EU-Funded
• 财政年份: 2022
• 资助国家: 英国
• 起止时间: 2022 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=10044974
• 关键词: PATTERN; Next; generation; ultra; speed

In PATTERN will world’s first process design kit (PDK) for microwave photonics at ultra-high frequencies above 100 GHz as well as bringing new functionalities into PIC such as magneto-optics isolators and acousto optics modulators (AOM). PATTERN’s approach to ultra-high frequencies is holistic and includes all the aspects such as design and simulation, generation, detestation, modulation, and packaging. To achieve this goal, we propose a massive hybrid integration of several different PIC platforms such as InP and LNOI but also including new materials such as Yttrium Iron Garnet (YIG). We also develop co-integration of electronic SiGe chips with PICs which especially a necessity in ultra-high speeds. LNOI is of the most promising emerging materials for PICs that comprises a unique set of interesting optical properties: a high electo-optic coefficient, a high intrinsic 2nd-order nonlinearity, and a large transparency window which makes it ideal for electronics manipulation of light at many wavelengths (EO modulation). InP is an ideal platform for generation and detection of light and YIG is a known magneto-optics material. If put together, truly novel, and advanced functionalities and opportunities arise. In addition, in PATTERN we developed packaging solutions and for such high frequencies which one of the main barriers in this field. Moreover, we also develop software expertise for design automation (e.g. RF signal routing) and end-to-end circuit simulation and design which is extremely challenging at these frequencies. We also demonstrate the capabilities of the platform in 6 different application-oriented prototypes. To achieve these objectives, PATTERN put together the expertise of 10 well know SMEs, RTOs and industrial players to achieve these objectives in 48 months project. Once developed, PATTERN will pave the way for the new generation of advanced PIC products in wide range of applications from telecom, 5G/6G to quantum technologies, LiDAR and sensing.

在PATTERN中，将推出世界上第一个用于100 GHz以上超高频微波光子学的工艺设计套件（PDK），并为PIC带来新功能，如磁光隔离器和声光调制器（AOM）。PATTERN的超高频方法是全面的，包括设计和仿真、生成、检测、调制和封装等所有方面。为了实现这一目标，我们提出了一个大规模的混合集成几个不同的PIC平台，如InP和LNOI，但也包括新材料，如钇铁石榴石（YIG）。我们还开发电子SiGe芯片与PIC的共集成，这在超高速中尤其必要。LNOI是用于PIC的最有前途的新兴材料之一，其包括一组独特的有趣的光学性质：高电光系数，高固有的二阶非线性，以及大的透明窗口，这使其成为许多波长的光的电子操纵（EO调制）的理想选择。InP是用于产生和检测光的理想平台，YIG是已知的磁光学材料。如果放在一起，真正新颖的，先进的功能和机会就会出现。此外，在PATTERN，我们开发了包装解决方案，并针对该领域的主要障碍之一的高频。此外，我们还开发用于设计自动化（例如RF信号路由）和端到端电路仿真和设计的软件专业知识，这在这些频率下极具挑战性。我们还展示了6个不同的面向应用的原型平台的功能。为了实现这些目标，PATTERN汇集了10家知名中小企业，RTO和行业参与者的专业知识，以在48个月内实现这些目标。一旦开发完成，PATTERN将为新一代先进的PIC产品铺平道路，其应用范围从电信，5G/6 G到量子技术，LiDAR和传感。