SINES (SINtering of Embedded Semiconductors)

拉姆创新公司设计和制造高功率密度电力电子模块。这种世界领先的功率密度是通过将裸芯片GaN和碳化硅功率器件直接嵌入印刷电路板来实现的。RAM正在投资其制造工艺和设备，使其能够满足对高功率密度电子产品日益增长的需求，这对通过交通运输和其他行业的电气化支持向Net-Zero过渡至关重要。SINES(嵌入式半导体烧结)项目专注于确保RAM能够获得最新的烧结技术，以实现高产量、高产量和高成本效益的批量生产过程。

RAM Innovations designs and manufactures high power density power electronics modules. This world leading power density is achieved through the embedding of bare die GaN and SiC power devices directly into printed circuit boards. RAM is investing in its manufacturing processes and equipment to enable it meet the growing demand for high power density electronics, critical to support the transition to Net-Zero through the electrification of transport and other industries.Project SINES (SINtering of Embedded Semiconductors) is focused on ensuring RAM has access to the latest Sintering technology to enable a high throughput, high yield and cost-effective volume manufacturing process.