"Ultra-Sleeve" - Advanced protective encapsulation for commercial-of-the-shelf semiconductor chips in extreme environments

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Ultra-Sleeve is a feasibility study to design, manufacture and evaluate an encapsulation solution based on diamond and related materials for protecting commercial off-the-shelf (COTS) semiconductor components used in cyber-physical systems for extreme environments. The initial focus of the project is targeted at proving the concept for on-board electronics that are commonly found in robotic and autonomous systems. The project will be led by Advancete Limited, a leading SME in laser processing techniques for advanced manufacturing. During the course of the project we will also look at the opportunities within the wider market sectors and produce a clear commercial roadmap for the future development and commercialisation of the technology. Throughout the project we will be supported by key industry players.