Embedded Electronic Packaging for Compound Semiconductor Power Applications

用于化合物半导体功率应用的嵌入式电子封装

• 批准号: 102888
• 金额: $ 9.41万
• 依托单位: TRIBUS-D LTD
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2017
• 资助国家: 英国
• 起止时间: 2017 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=102888
• 关键词: Embedded; Electronic; Packaging; Compound; Semiconductor

There is a growing need to generate, convert and distribute electric power from the source to the load, which is fulfilled through the use of power electronics. Packaging and assembly of the power electronics modules is important in determining the efficiency, size, weight and manufacturing costs. This project will seek to establish manufacturing methods to maximise thermal dissipation and minimise circuit parasitics through advanced interconnection and device embedding techniques and create a UK controlled supply chain for the manufacture of customised smart power modules.

越来越需要从电源到负载产生、转换和分配电力，这通过使用电力电子来实现。电力电子模块的封装和组装在确定效率、尺寸、重量和制造成本方面是重要的。该项目将寻求建立制造方法，通过先进的互连和设备嵌入技术最大限度地提高散热和减少电路寄生效应，并为定制智能功率模块的制造创建英国控制的供应链。