Embedded Electronic Packaging for Compound Semiconductor Power Applications

越来越多的人需要产生、转换和分配从电源到负载的电能，这是通过使用电力电子来实现的。电力电子模块的封装和组装是决定效率、尺寸、重量和制造成本的重要因素。该项目将寻求建立制造方法，通过先进的互连和器件嵌入技术，最大限度地提高散热和最大限度地减少电路寄生，并创建英国控制的供应链，用于制造定制的智能功率模块。

There is a growing need to generate, convert and distribute electric power from the source to the load, which is fulfilled through the use of power electronics. Packaging and assembly of the power electronics modules is important in determining the efficiency, size, weight and manufacturing costs. This project will seek to establish manufacturing methods to maximise thermal dissipation and minimise circuit parasitics through advanced interconnection and device embedding techniques and create a UK controlled supply chain for the manufacture of customised smart power modules.