Miniaturisation of intelligent power modules through advanced electronic packaging techniques

通过先进的电子封装技术实现智能功率模块的小型化

• 批准号: 132518
• 金额: $ 4.44万
• 依托单位: TRIBUS-D LTD
• 依托单位国家: 英国
• 项目类别: Feasibility Studies
• 财政年份: 2017
• 资助国家: 英国
• 起止时间: 2017 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=132518
• 关键词: Miniaturisation; intelligent; power; modules; through

There is a growing need to generate, convert and distribute electric power from the source to the load, which is fulfilled through the use of power electronics. Packaging and assembly of the power electronics modules is important in determining the efficiency, size, weight and manufacturing costs. This project will seek to establish manufacturing methods to maximise thermal dissipation and minimise circuit parasitics through advanced interconnection techniques and create a UK based supply chain for the manufacture of customised smart power modules.

越来越需要从电源到负载产生、转换和分配电力，这通过使用电力电子来实现。电力电子模块的封装和组装在确定效率、尺寸、重量和制造成本方面是重要的。该项目将寻求通过先进的互连技术建立制造方法，以最大限度地提高散热性并最大限度地减少电路寄生效应，并创建一个基于英国的供应链，用于制造定制的智能功率模块。