Innovative Microwave Interconnect Assembly For High Speed GaAs Photonic Modulators

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aXenic, a fabless design and manufacturer of high speed GaAs photonic modulators for the analogue radio over fibre and digital optical communications markets, is collaborating with Optocap, a provider of contract package design and assembly services for microelectronic and optoelectronic devices, to develop a new and innovative process for the microwave connection to the chip. Increasing demand for broadband services and increasing congestion on regulated radio spectrum is driving greater penetration of photonics into the wireless arena. A linear optical modulator with high bandwidth accurately transfers the RF signal onto optical fibre. Our current generation of modulators are limited in bandwidth due to the excess RF loss of the connection to the chip. The aim of this project is to realise a low loss, mechanically stable, reproducible connection to reach higher bandwidths for the next generation products. The dimensions of the microwave interconnect, optimised by 3D electromagnetic modelling, will be carefully controlled to realise the desired values of impedance, insertion loss and return loss. Optocap will develop a novel process to form & join the RF connector pin to the planar circuit. This process will be made available to the wider compound semiconductor community.