PrintAblate: Offset printed and Laser Ablated Flexible Circuits - Materials and Processes

PrintAblate：胶印和激光烧蚀柔性电路 - 材料和工艺

• 批准号: 103751
• 金额: $ 117.01万
• 依托单位: FLEXOTRONIX LIMITED
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2018
• 资助国家: 英国
• 起止时间: 2018 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=103751
• 关键词: PrintAblate; Offset; printed; Laser; Ablated

The project objective is to develop and inetgrate new and sophisticated materials and processing techniques for which there is a latent demand in the healthcare and industrial markets where new low cost digitally connected flexible electrical circuits can give improved performance characteristics for technical and commercial advantage. Ultimately a high productivity and high profitability integrated manufacturing process will convert 2D nanomaterials into components which enable a broad range of unique novel life changing digitally connected lighting and sensor based products. Flexotronix Ltd will work with Harman Technology, Synergy Devices and Nottinghsam Trent University to create advanced ink formulations. Flexotronix will print multilayers of ink on thin plastic sheet. Deposited layers will be patterend by M-SOLV to define small regions with microstructured detail.

该项目的目标是开发和集成新的和复杂的材料和加工技术，这在医疗保健和工业市场中有潜在的需求，在这些市场中，新的低成本数字连接的柔性电路可以提高技术和商业优势的性能特征。最终，高生产率和高利润率的集成制造工艺将把2D纳米材料转化为组件，从而实现一系列独特的、新颖的、改变生活的数字连接照明和传感器产品。flexxotronix有限公司将与哈曼科技、Synergy Devices和诺丁汉特伦特大学合作，开发先进的油墨配方。flexottronix将在薄塑料片上打印多层油墨。沉积层将通过M-SOLV进行图案化，以确定具有微观结构细节的小区域。