Photonic Chip Integration Facility

光子芯片集成设施

• 批准号: LE200100071
• 负责人: Prof Arnan Mitchell
• 金额: $ 35.67万
• 依托单位: RMIT University
• 依托单位国家: 澳大利亚
• 项目类别: Linkage Infrastructure, Equipment and Facilities
• 财政年份: 2021
• 资助国家: 澳大利亚
• 起止时间: 2021-03-19 至 2023-03-31
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/LE200100071
• 关键词: Photonic; Chip; Integration; Facility

This project will create a Photonic Chip Integration Facility responding to newly emerging global trends towards low loss waveguides and wider coverage of the optical spectrum. The tool will grow ultrahigh quality silicon nitride and oxide thin films in a manner that is compatible with electronics and other delicate materials, balancing flexibility for materials exploration with reliability and repeatability required for photonic chip systems research. The proposed facility will support Australian researchers from diverse disciplines spanning broadband networks, sensing, quantum technology, materials science, and beyond while providing a clear path for translating discoveries out of the lab towards scale up industrial manufacture

该项目将创建一个光子芯片集成设施，以应对低损耗波导和更广泛的光谱覆盖的新出现的全球趋势。 该工具将以与电子和其他精细材料兼容的方式生长高质量的氮化硅和氧化物薄膜，平衡材料探索的灵活性与光子芯片系统研究所需的可靠性和可重复性。拟议的设施将支持来自宽带网络，传感，量子技术，材料科学等不同学科的澳大利亚研究人员，同时为将实验室的发现转化为扩大工业制造提供明确的途径