Intermetallic compounds for high reliability electronic interconnections

用于高可靠性电子互连的金属间化合物

• 批准号: DP200101949
• 负责人: Prof Kazuhiro Nogita
• 金额: $ 30.18万
• 依托单位: The University of Queensland
• 依托单位国家: 澳大利亚
• 项目类别: Discovery Projects
• 财政年份: 2020
• 资助国家: 澳大利亚
• 起止时间: 2020-04-03 至 2024-12-31
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/DP200101949
• 关键词: Intermetallic; compounds; reliability; electronic; interconnections

The aim of the proposal is to develop an entirely new way of joining functional elements of circuit boards using tailored intermetallic joints that replace traditional solders. The outcome will be that electronic devices, from smart phones to smart grids and electric vehicles, will become more reliable and less susceptible to cracking and circuit failure. Electronics will last longer and less E-waste will be generated. This would revolutionise electronics manufacturing. The project has a high probability of achieving this breakthrough based on unique, world-class expertise in intermetallic compounds and characterisation that has already been established by the international network of Investigators.

该提案的目的是开发一种全新的方法，使用定制的金属间连接来连接电路板的功能元件，以取代传统的焊料。其结果将是，从智能手机到智能电网和电动汽车的电子设备将变得更可靠，更不容易破裂和电路故障。电子产品的寿命会更长，产生的电子垃圾也会更少。这将给电子制造业带来革命性的变化。该项目很有可能实现这一突破，其基础是国际调查人员网络已经确定的金属间化合物和特征方面独特的世界级专门知识。