Micro/nano-mechanical testing methodologies for interfacial adhesion

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This project aims to develop reliable approaches for measuring the toughness of a variety of metal/polymer interfaces integral to contemporary flexible devices. Adhesion between metal thin film conductors and polymer substrates is a critical factor influencing the reliability of the emerging polymer-based flexible electronics. This project will develop new methodologies for understanding the behaviour of these metal/polymer interfaces. This project will be a crucial enabler to accelerating the development of new flexible microelectronic technologies, from solar panels to electronic skin. This innovation will enable Australia to maintain an important connection to the rapidly-evolving international microelectronic industry and add significant value to Australian manufacturing industries.