Micro/nano-mechanical testing methodologies for interfacial adhesion

该项目旨在开发可靠的方法来测量当代柔性器件中各种金属/聚合物界面的韧性。金属薄膜导体与聚合物衬底之间的粘附性是影响新兴聚合物基柔性电子产品可靠性的关键因素。该项目将开发新的方法来理解这些金属/聚合物界面的行为。这个项目将是加速开发新的柔性微电子技术的关键推动者，从太阳能电池板到电子皮肤。这一创新将使澳大利亚与快速发展的国际微电子行业保持重要联系，并为澳大利亚制造业增加重要价值。

This project aims to develop reliable approaches for measuring the toughness of a variety of metal/polymer interfaces integral to contemporary flexible devices. Adhesion between metal thin film conductors and polymer substrates is a critical factor influencing the reliability of the emerging polymer-based flexible electronics. This project will develop new methodologies for understanding the behaviour of these metal/polymer interfaces. This project will be a crucial enabler to accelerating the development of new flexible microelectronic technologies, from solar panels to electronic skin. This innovation will enable Australia to maintain an important connection to the rapidly-evolving international microelectronic industry and add significant value to Australian manufacturing industries.