Intelligent Illumination LED Technology Platform

智能照明LED技术平台

• 批准号: 730016
• 金额: $ 7万
• 依托单位: GRAVITON LITE LIMITED
• 依托单位国家: 英国
• 项目类别: Legacy RDA Grant for R&D
• 财政年份: 2010
• 资助国家: 英国
• 起止时间: 2010 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=730016
• 关键词: Intelligent; Illumination; LED; Technology; Platform

The main types of LED used in today's products are surface mount and through hole. Through Hole LEOs arevery inefficient, usually only allowing a few 10s of milliamps to be passed through them before overheating and failing. Surprisinglyhowever, even today, many lamp manufacturers still use vast quantities of these LEOs in series and parallel circuits to act together to forman overall illuminator.Although cheap they are generally inefficient, short lived, corrode internally, of poor output capabilitiesand due to EU compliance legislation are difficult to dispose of. In addition they are incredibly inefficientat dissipating heat from the body of the device as to use them requires a through-hole PCB in thetraditional sense. When used in assemblies these are typically accompanied by very large elaborateheat sinks machined or extruded from aluminium. The main drawback of this is that the wholeassembly is too expensive to repair should it fail and in addition can only produce one colour of light.Despite all of these failings however the industry relies on vast quantities of these illuminators today, asthrow away lights of 2 - 5 year life span costing from a few to several hundreds of pounds each, thisinefficient practice in reality counters the "green" argument for their original use.Surface Mount, although a great leap forward both in terms of efficiency and output these packages still suffer from the same issues of itsthrough hole predecessor. They still come in a package, require soldering, suffer from poor heat dissipation (although are an improvement)corrode and are, conversely, very expensive sometimes to several pounds each.However, the use of surface mount packages has brought about aluminium-clad assemblies, arevolution in PCB technology, which has only recenUy hit the commercial stage. Despite this, some ofthe old failings still remain and in some cases have worsened. For example, the assembly of thealuminium clad requires specialist processes and tooling to raise the temperature of the entire boardto around 320 degrees before components can be soldered to them. The components are stillsoldered, which again causes yet another junction through which heat must be dissipated and due tothis they are even less serviceable than the through hole units. Although the boards are, new they stilluse the same heavy aluminium heat sinks and techniques and sold as a throw away item.However, where output illumination is the principle consideration the use of surface mount packages is where the current in-directcompetition resides, with only very small increases in power output being realised in each individual case between competitormanufacturers.

当今产品中使用的LED主要类型是表面贴装和通孔。通孔低轨卫星的效率非常低，通常只允许几十毫安的电流通过它们，然后就会过热而失效。然而令人惊讶的是，即使在今天，许多灯制造商仍然使用大量的串联和并联电路的LEO来共同作用以形成整体照明器。虽然便宜，但它们通常效率低，寿命短，内部腐蚀，输出能力差，并且由于欧盟合规立法而难以处理。此外，他们是令人难以置信的低效散热从身体的设备，因为使用它们需要一个通孔PCB在传统意义上.当在组件中使用时，这些通常伴随着非常大的精心加工或铝挤压的散热器。其主要缺点是，如果整个组件发生故障，维修费用太高，而且只能产生一种颜色的光。尽管有所有这些缺点，但工业界仍然依赖于今天大量的这些照明器，因为扔掉2 - 5年寿命的灯，每个灯的成本从几英镑到几百英镑不等，这种低效率的做法在现实中反驳了“绿色”的论点，为他们原来的用途。表面贴装，虽然一个巨大的飞跃，无论是在效率和输出这些封装仍然遭受同样的问题，其通孔的前身。它们仍然采用封装，需要焊接，散热差（虽然是一种改进），易腐蚀，而且，相反，非常昂贵，有时每个要几磅。然而，表面贴装封装的使用带来了铝包组件，这是PCB技术的革命，最近才进入商业阶段。尽管如此，一些旧的失败仍然存在，在某些情况下已经恶化。例如，铝包层的组装需要专业的工艺和工具，以提高整个电路板的温度到320度左右，然后才能将组件焊接到它们上。这些组件仍然是焊接的，这又会导致另一个结，热量必须通过它消散，因此它们甚至比通孔单元更难维修。虽然电路板是新的，但它们仍然使用相同的重型铝散热器和技术，并作为一次性物品出售。然而，在输出照明是主要考虑因素的情况下，表面贴装封装的使用是当前间接竞争的所在，在每个单独的情况下，竞争制造商之间的功率输出只有很小的增加。