ALBUMIN SOLDER FOR WOUND CLOSURE
ALBUMIN SOLDER FOR WOUND CLOSURE
批准号:
2643509
负责人:
ELIAHU HELDMAN
金额:
$10.0万
依托单位国家:
美国
项目类别:
财政年份:
1998
资助国家:
美国
项目状态:
已结题
起止时间:
1998-09-30 至 1999-02-28
关键词:
acidity /alkalinity albumins antiseptic sterilization bioengineering /biomedical engineering biotechnology cell adhesion cell proliferation chromatography drug design /synthesis /production fibroblasts guinea pigs heat ionic strengths lasers lyophilization method development protein denaturation protein engineering resin short chain fatty acid surgery material /equipment thermostability tissue /cell culture tryptophan wound healing
中文摘要
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英文摘要
Our objective is to develop an albumin solder as a complete or partial
substitute for sutures or staples during surgery. The solder is applied
on the wound and welding is achieved by laser irradiation. The welding
requires heat that may cause tissue necrosis. The investigators propose
to produce a "low temperature" solder by removing heat stabilizers from
albumin. To obtain a product suitable for clinical use, they plan to
introduce an additional viral inactivation step based on UVC
irradiation, to explore chromatographic techniques appropriate for the
removal of heat stabilizers (to reduce denaturation temperature), and
to explore a suitable bacterial sterilization technique based on either
gamma irradiation or sterile filtration. The methods of evaluation of
the solder quality and performance include: (i) quantitative
determination of heat stabilizers, (ii) determination of denaturation
temperature, (iii) in vitro determination of bonding strength using
hairless guinea pig skin, (iv) monitoring wound healing in vivo in a
dermal incision model in hairless guinea pigs, and (v) effect on cell
cultures relevant to wound healing. The significance of an albumin
solder for wound closure stems from limitations of the conventional
techniques, such as stapling and suturing, which in certain surgical
procedures are difficult and time consuming and may leak or bleed at the
suture line.
PROPOSED COMMERCIAL APPLICATION:
"Low temperature" albumin solder will provide a replacement for sutures
and staples. The clinical applications range from micro- to macro-
surgery. The albumin solder proposed here will be particularly useful
in minimally invasive surgery when sutures and staples are either
inappropriate, cumbersome, or time consuming. Albumin solder has a
market potential of at least $100 million.
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批准号:10544378
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项目类别:
-
资助金额:$60.0万
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财政年份:2022
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负责人:ELIAHU HELDMAN
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依托单位:
海外基金