POLYMERIC PROTECTION OF IMPLANTABLE MICRO-ELECTRONICS

植入式微电子器件的聚合物保护

• 批准号: 3297263
• 负责人: Philip R Troyk
• 金额: $ 11.06万
• 依托单位: ILLINOIS INSTITUTE OF TECHNOLOGY
• 依托单位国家: 美国
• 财政年份: 1988
• 资助国家: 美国
• 起止时间: 1988-04-01 至 1991-03-31
• 项目状态: 已结题
• 来源: https://reporter.nih.gov/project-details/3297263
• 关键词: biomaterial evaluation; biomaterial interface interaction; clinical biomedical equipment; electronic stimulator; imides; microelectrodes; physical property; polymers

Our long-term objective is the development of technology suitable for the packaging of chronically implantable micro-electronic integrated circuits. Integrated circuits, (micro-transducers) are needed to provide sensing and control functions to further the development of implantable electronic systems. Presently devices exists which could be used for implantable neuroprostheses, including auditory, bladder, diaphramatic, and cardiac (pacemaker) prosthetic devices, upper and lower extremity functional-neuromuscular-stimulation systems, cranial pressure monitors, blood ion and gas sensors, and implantable drug delivery systems for use with hypotension controlling drugs and insulin. During the past decade, the design of implantable electronic systems which incorporate subminiature integrated- circuit sensors and transducers has been seriously limited by the absence of packaging technologies suitable for the protection of the electronic devices from the physiological environment. The significance of limited sizes makes pacemaker packaging technology inapplicable. The present proposal incorporates basic studies which will identify materials and technologies capable of protecting chronically implanted I.C. transducers for periods of years, even decades, and is aimed at: 1. Determining the corrosion-control capabilities of polydimethylsiloxanes and polyimides used for the protection of implanted micro-electronic assemblies. Material parameters such as adhesion, hardness, permeability, elongation, and ear resistance will be correlated with performance. 2. Evaluating the effectiveness of surface preparation techniques including priming, cleaning, etching, and vacuum bake-out in reducing metallization corrosion through the reduction of electrical leakage currents. 3. Defining constraints affecting the selection and development of polymeric encapsulants for moisture protection of complete implantable devices in-vitro and in-vivo. Evaluation of encapsulation systems will be made with due regard for the special problems of output leads and biocompatibility. 4. Testing the modified materials on a sensor currently under development in our laboratory. This will be accomplished by designing and fabricating a subminiature interface from the I.C. to a miniature flexible electrical cable.

我们的长期目标是开发适合的技术 用于长期植入微电子产品的包装 集成电路。 集成电路（微传感器）是 需要提供传感和控制功能以进一步 植入式电子系统的开发。 目前 存在可用于植入的设备 神经假体，包括听觉假体、膀胱假体、隔膜假体和 心脏（起搏器）假体装置，上部和下部 四肢功能神经肌肉刺激系统，颅脑 压力监测器、血液离子和气体传感器以及植入式药物 与低血压控制药物一起使用的输送系统和 胰岛素。 在过去的十年中，植入式设备的设计 电子系统，其中包含超小型集成 电路传感器和换能器已受到严重限制 缺乏适合保护的包装技术 电子设备远离生理环境。 这 尺寸有限的重要性使得起搏器包装 技术不适用。 本提案包含基本的 研究将确定能够 保护长期植入的 I.C.换能器的周期 几年，甚至几十年，其目标是： 1. 确定腐蚀控制能力 用于保护的聚二甲基硅氧烷和聚酰亚胺 植入微电子组件。 材料参数如 附着力、硬度、渗透性、伸长率、抗耳性 将与性能相关。 2. 评估表面处理技术的有效性 包括底漆、清洁、蚀刻和真空烘烤 通过减少金属化腐蚀 漏电流。 3. 定义影响选择和开发的约束条件 聚合物封装剂的防潮保护 体外和体内植入式设备。 评价 封装系统的制作将适当考虑 输出引线和生物相容性的特殊问题。 4. 在当前传感器上测试改性材料 我们实验室的发展。 这将通过以下方式完成 设计和制造 I.C. 的超小型接口 到微型柔性电缆。