POLYMERIC PROTECTION OF IMPLANTABLE MICRO-ELECTRONICS

植入式微电子器件的聚合物保护

• 批准号: 3297259
• 负责人: Philip R Troyk
• 金额: $ 13.67万
• 依托单位: ILLINOIS INSTITUTE OF TECHNOLOGY
• 依托单位国家: 美国
• 财政年份: 1988
• 资助国家: 美国
• 起止时间: 1988-04-01 至 1991-03-31
• 项目状态: 已结题
• 来源: https://reporter.nih.gov/project-details/3297259
• 关键词: biomaterial evaluation; biomaterial interface interaction; clinical biomedical equipment; electronic stimulator; imides; microelectrodes; physical property; polymers

Our long-term objective is the development of technology suitable for the packaging of chronically implantable micro-electronic integrated circuits. Integrated circuits, (micro-transducers) are needed to provide sensing and control functions to further the development of implantable electronic systems. Presently devices exists which could be used for implantable neuroprostheses, including auditory, bladder, diaphramatic, and cardiac (pacemaker) prosthetic devices, upper and lower extremity functional-neuromuscular-stimulation systems, cranial pressure monitors, blood ion and gas sensors, and implantable drug delivery systems for use with hypotension controlling drugs and insulin. During the past decade, the design of implantable electronic systems which incorporate subminiature integrated- circuit sensors and transducers has been seriously limited by the absence of packaging technologies suitable for the protection of the electronic devices from the physiological environment. The significance of limited sizes makes pacemaker packaging technology inapplicable. The present proposal incorporates basic studies which will identify materials and technologies capable of protecting chronically implanted I.C. transducers for periods of years, even decades, and is aimed at: 1. Determining the corrosion-control capabilities of polydimethylsiloxanes and polyimides used for the protection of implanted micro-electronic assemblies. Material parameters such as adhesion, hardness, permeability, elongation, and ear resistance will be correlated with performance. 2. Evaluating the effectiveness of surface preparation techniques including priming, cleaning, etching, and vacuum bake-out in reducing metallization corrosion through the reduction of electrical leakage currents. 3. Defining constraints affecting the selection and development of polymeric encapsulants for moisture protection of complete implantable devices in-vitro and in-vivo. Evaluation of encapsulation systems will be made with due regard for the special problems of output leads and biocompatibility. 4. Testing the modified materials on a sensor currently under development in our laboratory. This will be accomplished by designing and fabricating a subminiature interface from the I.C. to a miniature flexible electrical cable.

我们的长远目标是发展适用于 用于可长期植入的微电子的封装 集成电路。集成电路，(微型传感器) 需要提供传感和控制功能，以进一步 可植入电子系统的开发。目前 存在可用于植入的设备 神经假体，包括听觉、膀胱、横隔肌和 心脏(起搏器)假体装置，上部和下部 肢体功能-神经-肌肉刺激系统，颅骨 压力监测器、血液离子和气体传感器以及植入性药物 与降压控制药物和药物一起使用的输送系统 胰岛素。在过去的十年里，植入物的设计 集成了超小型集成的电子系统- 电路传感器和换能器一直严重受限于 缺乏适用于保护的包装技术 使电子设备远离生理环境。这个 有限尺寸的意义使起搏器包装 技术不适用。本提案包含了基本的 研究将确定材料和技术能够 保护长期植入的I.C.换能器 几年，甚至几十年，目标是： 1.确定其防腐能力 用于防腐的聚二甲基硅氧烷和聚酰亚胺 植入的微电子组件。材料参数，如 如附着力、硬度、渗透性、延伸率和耐耳朵 将与性能相关。 2.评估表面处理技术的有效性 包括底漆、清洗、蚀刻和真空烘烤 通过减少金属腐蚀减少金属腐蚀 漏电电流。 3.明确影响选拔发展的制约因素 全套防潮用聚合物密封剂的研究 体外和体内可植入装置。评估 在制作封装系统时将适当考虑 产量领先和生物兼容性的特殊问题。 4.在目前正在测试的传感器上测试改性材料 我们实验室的发展。这将通过以下方式实现 利用IC设计和制造超小型接口。 到一根微型的柔性电缆。