Understanding failure mechanisms in micro-solder joints in three dimensional integrated circuit packaging

点击翻译按钮获取中文摘要

High-density three-dimensional integrated circuits used in microelectronic devices are evolving and placing increasing demands on micro-solder joints. Tin based lead-free solder alloys require further development to satisfy performance requirements, particularly with respect to the properties of the intermetallic forms between solder and substrate. This project investigates the mechanical properties and deformation mechanisms of intermetallic forms with trace element additions using micro-pillar compression and ultra-high voltage transmission electron microscopy. Beyond the development of techniques transferable to similar research, this project will lead to significant intellectual property relating to solder composition.