Understanding failure mechanisms in micro-solder joints in three dimensional integrated circuit packaging

了解三维集成电路封装中微焊点的失效机制

• 批准号: DE140100188
• 负责人: Dr Yueqin Wu
• 金额: $ 27.55万
• 依托单位: The University of Queensland
• 依托单位国家: 澳大利亚
• 项目类别: Discovery Early Career Researcher Award
• 财政年份: 2014
• 资助国家: 澳大利亚
• 起止时间: 2014-01-01 至 2017-01-14
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/DE140100188
• 关键词: Understanding; failure; mechanisms; micro; solder

High-density three-dimensional integrated circuits used in microelectronic devices are evolving and placing increasing demands on micro-solder joints. Tin based lead-free solder alloys require further development to satisfy performance requirements, particularly with respect to the properties of the intermetallic forms between solder and substrate. This project investigates the mechanical properties and deformation mechanisms of intermetallic forms with trace element additions using micro-pillar compression and ultra-high voltage transmission electron microscopy. Beyond the development of techniques transferable to similar research, this project will lead to significant intellectual property relating to solder composition.

用于微电子器件的高密度三维集成电路正在发展，并且对微焊点提出了越来越高的要求。锡基无铅焊料合金需要进一步开发，以满足性能要求，特别是关于焊料和基板之间的金属间化合物的性质。本计画利用微柱压缩及超高压透射电子显微镜，研究添加微量元素之金属间化合物之机械性质及变形机制。除了开发可转移到类似研究的技术外，该项目还将导致与焊料成分相关的重要知识产权。