Performance Improvements to 2-D Ultrasound Arrays

二维超声阵列的性能改进

• 批准号: 6403082
• 负责人: Wesley S. Hackenberger
• 金额: $ 10.62万
• 依托单位: TRS TECHNOLOGIES, INC.
• 依托单位国家: 美国
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-07-01 至 2002-04-30
• 项目状态: 已结题
• 来源: https://reporter.nih.gov/project-details/6403082
• 关键词: bioimaging /biomedical imaging; biomedical equipment development; dielectric property; electrical conductance; sound impedance; ultrasonography

DESCRIPTION (Provided by Applicant): This proposed program uses advanced patterning and alignment technology from the multiplayer ceramic packaging industry to construct 2-D ultrasound arrays with multiplayer PZT posts to increase capacitance and, therefore, transducer signal to noise ratio (SNR). Conventional 2-D transducer arrays provide many advantages for medical ultrasound imaging, but the performance often suffers from the low capacitance elements and poor impedance matching. Use of cofired multiplayer technology to produce individual array elements is a good solution to the impedance mismatch problem because capacitance increases with the square of the number of layers in an element. It was estimated that a 3-layer 2-D array will increase SNR by 9 dB and a 5 layer array will achieve close to 14 dB improvements. Making electrical connections to fine scale, three dimensional ceramic structures was not possible until recently. The progress made in the electronic ceramic packaging industry in the past 5 years, with 75 and 25 1lm resolution for via punching and precision alignment, respectively, has made this concept feasible. For the Phase I effort, we will demonstrate the feasibility by constructing a 3.5 to 5 MHz 2-D array from multilayer PZT. PROPOSED COMMERCIAL APPLICATION: The most immediate application for 2-D arrays is cardiac volumetric imaging. Successful multiplayer 2-D arrays would be drop-in replacement for current 2-D array technology. Markets for real time volumetric scanning also exist in radiology and obstetrics where slow 3-D ultrasound scanning is of limited value.

描述（由申请人提供）：本提议的程序使用先进的 多层陶瓷封装的图案化和对准技术 行业将构建具有多层 PZT 柱的二维超声阵列 增加电容，从而提高传感器信噪比 (SNR)。 传统的二维换能器阵列为医疗提供了许多优势 超声成像，但性能往往受到低电容的影响 元件和阻抗匹配不良。使用共烧多人技术 产生单独的阵列元件是解决阻抗失配的一个好方法 问题是因为电容随着层数的平方而增加 在一个元素中。据估计，3层二维阵列将使信噪比提高9 dB 和 5 层阵列将实现接近 14 dB 的改进。制作 与精细尺寸的三维陶瓷结构的电连接 直到最近才成为可能。电子陶瓷的进展 过去5年封装行业，过孔分辨率为75和25 1lm 冲压和精密对准分别使这一概念变得可行。 对于第一阶段的工作，我们将通过构建一个 多层 PZT 制成的 3.5 至 5 MHz 二维阵列。 拟议的商业应用： 二维阵列最直接的应用是心脏体积成像。 成功的 多人二维阵列将直接替代当前的二维阵列技术。 实时体积扫描市场也存在于放射学和产科领域 慢速 3D 超声扫描的价值有限。