Environmentally friendly plasma processing

化合物半导体是实现净零排放的多种关键使能技术的基础。许多具有高全球变暖潜能值（GWP）的气体在此类技术的制造步骤中起着重要作用。该项目的重点是全氟化合物，特别是全球变暖潜能值分别为23500和17200的SF6和NF3。在等离子体蚀刻和等离子体增强化学气相沉积（PECVD）室的清洗中，PFCs被用作氟自由基的来源。由于SF6和NF3分子的稳定性，它们是具有长大气寿命的合成分子。前驱体供应链中的大气损失，以及等离子体加工工具废气中未裂解分子的排放，对半导体行业的净温室气体排放有很大贡献。目前减少此类排放的尝试集中在过程优化和使用点减排系统上。我们的目标是通过对低GWP替代品的系统研究来消除这些排放。此外，我们将研究减排和工艺优化技术，以最大限度地减少废气的影响。该项目与工业密切相关，因此将重点关注可扩展性，同时保持CS结构的质量。

Compound Semiconductors are the basis of multiple key enabling technologies in the move to net zero emissions. A number of gases of high Global Warming Potential (GWP) are instrumental in the fabrication steps of such technologies. This project focusses on Perfluorinated Compounds (PFCs), particularly SF6 and NF3 with GWPs of 23500 and 17200 respectively. PFCs are used as sources of fluorine radicals in Plasma Etching, and for the cleaning of Plasma Enhanced Chemical Vapour Deposition (PECVD) chambers. SF6 and NF3 are synthetic molecules with long atmospheric lifetimes, in virtue of the molecule's stability. Losses to atmosphere within the precursor supply chains, and the emission of uncracked molecules in the exhaust of plasma processing tools contributes significantly to the net greenhouse gas emissions of the semiconductor industry. Current attempts to minimise such emissions focus on process optimisation and point of use abatement systems. We aim to eliminate these emissions through the systematic investigation of low GWP alternatives. Additionally, we'll investigate abatement and process optimisation techniques to minimise impacts from exhaust gasses. This project is extremely relevant to industry, and thus will focus heavily on scalability while maintaining the quality of CS structures.