Environmentally friendly plasma processing

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Compound Semiconductors are the basis of multiple key enabling technologies in the move to net zero emissions. A number of gases of high Global Warming Potential (GWP) are instrumental in the fabrication steps of such technologies. This project focusses on Perfluorinated Compounds (PFCs), particularly SF6 and NF3 with GWPs of 23500 and 17200 respectively. PFCs are used as sources of fluorine radicals in Plasma Etching, and for the cleaning of Plasma Enhanced Chemical Vapour Deposition (PECVD) chambers. SF6 and NF3 are synthetic molecules with long atmospheric lifetimes, in virtue of the molecule's stability. Losses to atmosphere within the precursor supply chains, and the emission of uncracked molecules in the exhaust of plasma processing tools contributes significantly to the net greenhouse gas emissions of the semiconductor industry. Current attempts to minimise such emissions focus on process optimisation and point of use abatement systems. We aim to eliminate these emissions through the systematic investigation of low GWP alternatives. Additionally, we'll investigate abatement and process optimisation techniques to minimise impacts from exhaust gasses. This project is extremely relevant to industry, and thus will focus heavily on scalability while maintaining the quality of CS structures.