Soft 3D printed structures with integrated flexible electronics

具有集成柔性电子器件的软 3D 打印结构

• 批准号: 2654885
• 金额: --
• 依托单位: University of Sussex
• 依托单位国家: 英国
• 项目类别: Studentship
• 财政年份: 2021
• 资助国家: 英国
• 起止时间: 2021 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=studentship-2654885
• 关键词: Soft; 3D; printed; structures; integrated

Recent advances in materials science and new fabrication processes drive a paradigm shift in electrical and mechanical engineering. Instead of rigid bulky structures such as silicon wafers and metal frames, soft biomimetic approaches are envisioned. Novel semiconductors and polymeric substrates result in flexible electronics which can be unobtrusively attached to biological or synthetic tissue and be used to realize sensor systems which naturally conform to static or dynamic three-dimensional surfaces. At the same time, 3D printing of soft materials offers the possibility to realize mechanical systems which are reconfigurable and able to mimic the deformability and mechanical properties of human skin or soft robots.The parallel optimization of mechanical, electrical, and biological properties by using advanced fabrication techniques and materials offers the possibility to realize biomimetic systems e.g. for healthcare applications. In particular, sensory patches adapting to the artificial or biological systems promise to lead to new kinds of wearables not restricting the movement or comfort of limbs or skin, supporting athletes or the rehabilitation of patients.The aim of this project is to work on novel electronics concepts by combining deformable structures with flexible electronics to realize adaptable systems with monolithically integrated electronics for sensing applications. This can include interconnections made from liquid metals, soft sensors or deformable transistors. All these elements should be combined to detect parameters relevant for healthcare or soft robotics applications.This project combines electrical and mechanical engineering with material science and innovative fabrication methods. A particular focus will be set on using a recently acquired high resolution Optomec Aerosol Jet printer. Ultimately a smart biomimetic system will be realized using thin film technology and 3D printing of soft rubber materials.

材料科学和新制造工艺的最新进展推动了电气和机械工程的范式转变。人们设想采用软仿生方法，而不是硅晶片和金属框架等刚性笨重结构。新型半导体和聚合物基板产生柔性电子器件，可以不显眼地附着在生物或合成组织上，并用于实现自然地符合静态或动态三维表面的传感器系统。同时，软材料3D打印为实现可重构的机械系统提供了可能性，并且能够模仿人类皮肤或软机器人的变形能力和机械性能。通过使用先进的制造技术和材料并行优化机械、电气和生物性能，为实现仿生系统（例如机器人）提供了可能性。用于医疗保健应用。特别是，适应人工或生物系统的传感贴片有望带来新型可穿戴设备，不会限制四肢或皮肤的运动或舒适度，支持运动员或患者的康复。该项目的目的是研究新颖的电子概念，将可变形结构与柔性电子器件相结合，以实现具有单片集成电子器件的自适应系统，用于传感应用。这可以包括由液态金属、软传感器或可变形晶体管制成的互连。所有这些元素应结合起来，以检测与医疗保健或软机器人应用相关的参数。该项目将电气和机械工程与材料科学和创新制造方法结合起来。将特别关注使用最近购买的高分辨率 Optomec Aerosol Jet 打印机。最终将利用薄膜技术和软橡胶材料3D打印来实现智能仿生系统。