ELECTROCHEMICAL MOULDING OF METALS THROUGH PROTEINS

本子项目是利用由NIH/NCRR资助的中心赠款提供的资源的众多研究子项目之一。子项目和研究者（PI）可能已经从另一个NIH来源获得了主要资金，因此可以在其他CRISP条目中表示。列出的机构是中心的，不一定是研究者的机构。利用TEM倾斜序列图像的相关平均，确定了无机p型半导体氧化亚铜的三维纳米结构，该氧化亚铜通过来自耐辐射球菌的六边形填充中间层（hpi层）蛋白质的孔隙电沉积。

This subproject is one of many research subprojects utilizing the resources provided by a Center grant funded by NIH/NCRR. The subproject and investigator (PI) may have received primary funding from another NIH source, and thus could be represented in other CRISP entries. The institution listed is for the Center, which is not necessarily the institution for the investigator. Correlation averaging of TEM tilt-series images is used to determine the 3D nanostructure of the inorganic p-type semiconductor cuprouos oxide electrodeposited through the pores of the hexagonally packed intermediate layer (HPI-layer) protein from Deinococcus radiodurans.