Development of a Miniature Refrigeration System for Electronics Cooling

用于电子设备冷却的微型制冷系统的开发

• 批准号: EP/E028705/1
• 负责人: Brian Agnew
• 金额: $ 38.76万
• 依托单位: Newcastle University
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2007
• 资助国家: 英国
• 起止时间: 2007 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FE028705%2F1
• 关键词: Development; Miniature; Refrigeration; System; Electronics

This application is for collaborative research on an area of cooling of great industrial and social significance by three teams with expertise in heat transfer, system simulation and component design. The lead team will be based at Newcastle University with the support teams at Oxford and South Bank UniversitiesIf the performance of electronic chips follow current trends and double every 18 months (Moore's Law), then it will soon not be possible to effectively cool them using conventional passive cooling and an alternative technique/devices must be found. This proposal is concerned with developing such a device. In particular it is concerned with a theoretical analysis and experimental evaluation of a miniature vapour compression refrigeration cycle optimised for the cooling of future electronic systems. The proposed work will consist of three distinct but interrelated activities that will be conducted at three centres by personnel with recognised skills, expertise, resources and experience to undertake this work. The proposed work is innovative in that it will examine issues associated with miniature refrigeration systems that have not been studied hitherto. It is intended to explore design criteria related to system stability and develop design codes to assist designers and manufacturers of such systems. The heat transfer performance of phase change in porous materials and the technology transfer associated with the compressor development all contribute to making this a very innovative project. The groups already have experience of working together and arrangements will be put in place to facilitate the exchange of ideas and expertise on a larger scale. The integrated approach will provide significant advantages compared to three unlinked projects and produce a significant step forward in electronic cooling technology. The work will be supported by several industrial partners and collaborators namely Thermacore, Panasonic and Honeywell who will all contribute technical and in kind resources to the project. Letters of support have been obtained from Panasonic, Thermacore, Honeywell-Hymatic and Hexag.

该应用程序由三个在传热、系统仿真和组件设计方面拥有专业知识的团队合作研究具有重大工业和社会意义的冷却领域。领导团队将设在纽卡斯尔大学，支持团队将设在牛津大学和南岸大学。如果电子芯片的性能遵循当前趋势，每 18 个月翻一番（摩尔定律），那么使用传统的被动冷却将很快无法有效冷却它们，必须找到替代技术/设备。该提案涉及开发这样的设备。特别是，它涉及针对未来电子系统冷却而优化的微型蒸汽压缩制冷循环的理论分析和实验评估。拟议的工作将包括三项不同但相互关联的活动，这些活动将由具有公认的技能、专业知识、资源和经验的人员在三个中心开展开展这项工作。拟议的工作具有创新性，因为它将研究迄今为止尚未研究过的与微型制冷系统相关的问题。其目的是探索与系统稳定性相关的设计标准并开发设计规范以协助此类系统的设计者和制造商。多孔材料相变的传热性能以及与压缩机开发相关的技术转让都有助于使该项目成为一个非常创新的项目。这些小组已经有了合作的经验，并将做出安排，以促进更大规模的想法和专业知识的交流。与三个不相关的项目相比，该集成方法将提供显着的优势，并在电子冷却技术方面取得重大进步。这项工作将得到 Thermacore、松下和霍尼韦尔等多家工业合作伙伴和合作者的支持，他们都将为该项目提供技术和实物资源。已获得 Panasonic、Thermacore、Honeywell-Hymatic 和 Hexag 的支持函。