Micropackage Technology for Implantable Biomedical Microsystems

用于植入式生物医学微系统的微封装技术

• 批准号: 8227455
• 负责人: WEN H KO
• 金额: $ 20.98万
• 依托单位: CASE WESTERN RESERVE UNIVERSITY
• 依托单位国家: 美国
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-01-01 至 2013-12-31
• 项目状态: 已结题
• 来源: https://reporter.nih.gov/project-details/8227455
• 关键词: Address; Animal Model; Area; Biocompatible; Biological Sciences; Biomedical Research; Body Fluids; Boxing; Ceramics; Chemicals; Clinical; Cochlear Implants; Controlled Environment; Deposition; Devices; Electrodes; Electronics; Engineering; Evaluation; Failure; Film; Frequencies; Health Services Research; Healthcare; Human; Immersion Investigative Technique; Implant; Lasers; Lead; Life; Mechanics; Medical Research; Methods; Monitor; Neck; Organ; Performance; Permeability; Polychlorinated Biphenyls; Process; Prosthesis; Radio; Research; Resolution; Saline; Surface; System; Techniques; Technology; Telemetry; Testing; Thick; Time; Vision; Weight; Wireless Technology; atomic layer deposition; base; clinical care; cost; density; design; ductile; flexibility; implantable device; innovation; instrument; meetings; microsystems; miniaturize; nanoelectromechanical system; nanometer; nanoscale; next generation; novel; novel strategies; relating to nervous system; tool; urinary; vapor; water vapor

DESCRIPTION (provided by applicant): The objective of this 2 year project is to study, develop, and demonstrate a non-hermetic, biocompatible micro- package technology for microfabricated wireless implantable devices or systems used in bio-medical research and clinical care. The volume and weight of these micropackages shall be as small as possible, with a total thickness of the conformal package layers being less than 0.25 mm and the added volume only ~20-80% of the original system before packaging (compared to ~10x or more volume increase in conventional hermetic packages). The implant life time will be from a few months to a few years. Advances in integrated circuits, micro- and nano-electromechanical systems (MEMS/NEMS), as well as thin film rechargeable batteries and other miniaturized devices, make it now possible to realize the great potential of microfabricated implantable or surface-attached biomedical instruments for life science research and health care beyond what microelectronics alone could offer. The volume and weight of these microsystems are reduced and the performance is enhanced over several orders of magnitude as compared with their macroscale counterparts of two decades ago. However, a critical challenge, and thus a bottle neck to clinical implementation, is the lack of a suitable micropackage that is on the same size scale as these micro-systems. The conventional hermetic box package used to protect microelectronics is too restrictive to meet the needs of next-generation implantable microsystems. This project aims to explore and validate the following hypotheses: (i) A non-hermetic thin film micropackage technology for microfabricated implantable devices can be developed. (ii) A package made from multilayered thin film coatings will have a significantly reduced density of coating faults and a greater life time as compared with a single layer of the same thickness. (iii) A multilayer consisting of nano-meter thin brittle ceramic films interlaced with ductile films can be an excellent, flexible vapor barrier with mechanical flexibility. (iv) Micropackaging techniques for functional implantable micro-system can be developed using standard MEMS fabrication tools combined with additional MEMS-friendly processes such as laser cutting, ultrathin film deposition (i.e., atomic layer deposition), surface cleaning methods, and clean chemical processing chambers. This two-year research effort will primarily focus on the following tasks: (i) Developing the micropackage concepts and techniques to verify the aforementioned hypotheses using micropackaged PCBs. (ii) Designing and packaging RF recharge and controlled pilot telemetry devices for evaluation in the accelerated lifetime test set-up (e.g., immersion in 85 C saline solution). (iii) Implant functional telemetry units in animal models to demonstrate the merits of the micropackage technology in functional implantable micro-systems for biomedical research and health care, where the device size, weight, package cost and turn-around time are important. PUBLIC HEALTH RELEVANCE: Project Narrative This proposal aims to develop a novel, non-hermetic, low-profile packaging technology designed for long-term protection of environmentally-sensitive components in wireless, implantable microdevices, thus addressing the most significant technical bottleneck inhibiting the clinical implementation of these technologies in applications such as neural interfacing, cardiac care, and urinary control to name a few.

描述（由申请人提供）：该2年项目的目的是研究，开发和演示用于生物医学研究和临床护理中使用的微型无线可植入设备或系统的非热，生物相容性的微包装技术。这些微型包装的体积和重量应尽可能小，共形包装层的总厚度小于0.25 mm，包装前的添加体积仅为原始系统的约20-80％（相比之下，传统的封装包装中〜10倍或更多的体积增加）。植入寿命将从几个月到几年。综合电路，微型电机机电系统（MEM/NEMS）以及薄膜可充电电池和其他微型化的动力的进步，现在可以实现微型植入或表面表面与单独的生命科学研究和医疗保健服务的巨大潜力。与二十年前的宏观同行相比，这些微系统的体积和重量减小了，并且在几个数量级上的性能增强。但是，一个关键的挑战，因此是临床实施的瓶颈，是缺乏与这些微型系统相同尺寸的合适微型包装。用于保护微电子的常规密封盒包装太过限制，无法满足下一代可植入的微型系统的需求。该项目旨在探索和验证以下假设：（i）可以开发出一种用于微生物植入式设备的非热薄膜微型包装技术。 （ii）与单层相同厚度的单层相比，由多层薄膜涂料制成的包装将显着降低涂料断层的密度和更长的寿命。 （iii）由纳米米薄陶瓷膜组成的多层层与延性薄膜交织在一起，可以是具有机械柔韧性的极好，柔性的蒸气屏障。 （iv）可以使用标准MEMS制造工具与其他MEMS友好型工艺（例如激光切割，超薄膜沉积（即原子层沉积），表面清洁方法和清洁化学加工室相结合，可以使用标准MEMS制造工具与其他MEMS友好过程结合使用标准MEMS制造工具来开发（iv）用于功能性植入型微型系统的微型易碎技术。这项为期两年的研究工作将主要集中在以下任务上：（i）开发使用微型PCB的Micropackage概念和技术来验证上述假设。 （ii）设计和包装RF充值和受控的试点遥测设备，以评估加速的寿命测试设置（例如，浸入85 C盐水溶液中）。 （iii）动物模型中的植入功能遥测单元，以证明在功能植入式微型系统中，用于生物医学研究和医疗保健的功能性植入式微型系统的优点，其中设备尺寸，重量，包装成本和转盘时间很重要。 公共卫生相关性：项目叙事该提案旨在开发一种新型的，非热的，低调的包装技术，旨在长期保护无线，可植入的微型电视中对环境敏感的组件的长期保护，从而抑制这些技术在这些技术中的临床实施，以解决这些技术的临床实施，例如，诸如Neural Interfacs Interfacing，CardCorce Contrance Cartracs Carece and Card，Card，Card Care Care和uniralional and urearional and urearional and urearional and ureary and Iriarnial and urearional。