Microscale vapor compression refrigeration

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The rapid evolution of consumer and commercial electronics has been attainable in large part due to the ability of engineers and physicists to concentrate millions of electronics devices into integrated circuits the size of a postage stamp. Densely populated electronics devices also lead to high concentrations of heat flux which in turn leads to elevated temperatures and a dramatic decrease in product reliability. Traditional cooling procedures, such as using a fan to force air over hot components, are effective but only in low power applications.  As power requirements increase, electronics designers are forced to rethink cooling strategies, including the use of microscale refrigeration. This research initiative will involve the miniaturization of a conventional vapor compression refrigeration process to produce micro (overall dimensions of millimeters) and mini (overall dimensions of centimeters) refrigeration units.  Optimum operating conditions will be achieved by developing fundamental models for estimating heat transfer and pressure drop based on a minimization of entropy production in the system.  Working prototypes will be built using Computerized Numerically Controlled (CNC) machines for the mini-scale units and Micro Electro-Mechanical Systems (MEMS) techniques for the micro-scale units.  The prototypes will be bench tested to characterize the thermal performance for a range of operating conditions.   The development of smaller, more effective heat dissipation devices for electronics cooling will have a profound influence on the evolution of a wide range of products, including computers, automotive electronics and electric motors, to name a few.