Scanning vibrometer for 3D MEMS dynamic characterization

该提案要求为购买激光多普勒振动测量（LDV）系统提供资金，该系统能够在高频下表征3D微/纳米机电系统（MEMS/NEMS）动态特性。我们小组和阿尔伯塔大学的几个研究项目将利用所要求的设备，包括使用老化生物医学、机械、航空航天、民用或环境系统周围的环境振动对基于能量收集MEMS/NEMS的设备进行动态表征。我们的团队还参与了许多其他项目，包括高谐振频率的MEMS/NEMS致动器，例如结构改进的射频开关，以减少高频（20 MHz）的集肤效应。激光多普勒测振仪是一种被广泛接受的MEMS/NEMS动态表征工具。使用自动扫描功能，LDV可以测量结构共振，并显示出平面外的偏转形状，振幅低至皮米级，频率高达30 MHz。这种LDV目前正在整个MEMS/NEMS社区中使用，以表征微器件的动态特性，例如光学开关，振动杠杆，膜，致动器，电机，微光学器件和扭转振荡器。激光振动测量的应用包括：（1）器械响应的动态测试，以确定机械参数，如谐振频率、刚度和阻尼，（2）设计开发和发布过程中器械响应的表征，（3）验证设计性能与预期FEA模型预测，（4）确定机械激励下的可靠性（引线键合、环境振动和冲击）、辐射、温度、湿度和压力应力，以及（5）在低至纳米尺度的宽范围移动内校准致动器和传感器位移与驱动电压。

This proposal request funding for purchasing of Laser Doppler Vibrometry (LDV) system that has the capability of characterizing the 3D Micro/NANO Electro Mechanical Systems (MEMS/NEMS) dynamics at high frequency. Several research projects in our group and the University of Alberta will utilize the requested equipments including, dynamic characterization of energy harvesting MEMS/NEMS based devices using ambient vibrations surrounding an aging biomedical, and mechanical, aerospace, civil or environmental system. Our group is involved in a number of other projects that include MEMS/NEMS actuators at high resonance frequency, such as structurally modified Radio Frequency switch toward the reduction of skin effect at high frequency (20 MHz). Laser Doppler Vibrometry is a widely accepted tool for dynamic characterization of MEMS/NEMS. Using automated scan capability, LDV can measure structural resonance and display out-of-plane deflection shapes with amplitudes down to the picometer level and frequencies to 30 MHz. This LDV is presently being used throughout the MEMS/NEMS community to characterize the dynamics of micro-devices such as optical switches, vibrating cantilevers, membranes, actuators, motors, micro-optics and torsional oscillators. Applications for Laser Vibrometry measurements include: (1) Dynamic testing of device response to determine mechanical parameters such as resonant frequency, stiffness and damping, (2) Characterization of device response during design development and release processes, (3) Validate design performance versus expected FEA model predictions, (4) Determine reliability under mechanical excitation (wire bonding, environmental vibration and shock), radiation, temperature, humidity and pressure stress by targeting device inside environmental or vacuum chamber and (5) Calibrate actuator and sensor displacements versus drive voltage over wide range of movements down to nano meter scale.