Research and Development of Substrate Integrated Circuits and Systems for Gigahertz and Terahertz Electronics and Photonics

千兆赫和太赫兹电子和光子学衬底集成电路和系统的研究与开发

基本信息

  • 批准号:
    122137-2012
  • 负责人:
  • 金额:
    $ 4.52万
  • 依托单位:
  • 依托单位国家:
    加拿大
  • 项目类别:
    Discovery Grants Program - Individual
  • 财政年份:
    2014
  • 资助国家:
    加拿大
  • 起止时间:
    2014-01-01 至 2015-12-31
  • 项目状态:
    已结题

项目摘要

The proposed research aims to investigate and explore an emerging and disruptive technology called "substrate integrated circuits (SICs)" towards the development of millimetre-wave and terahertz integrated circuits (MTICs). This concept of SICs was pioneered by the applicant over a decade ago. Substrate integrated waveguides (SIWs), which belong to the family of SICs, have been widely studied and successfully explored by researchers around the world, under the leadership of the applicant, for the development of a new generation microwave and millimetre-wave integrated circuits and systems. The fundamental feature of SICs is that almost all non-planar guided-wave structures can be synthesized and transformed into planar form at low cost, thereby making full integrations of such structures possible. Therefore, both planar and non-planar structures can be seamlessly integrated and made of the same processing techniques. This building platform holds the promise of becoming the next generation integrated circuits for millimetre-wave and terahertz systems and unifying the physical mechanisms of electronics and photonics. This research allows the applicant to continue leading international research efforts in discovering new circuit features, new design rules, new innovative devices, and new application areas. This will involve unconventional, multilayered substrates and mixed dielectric-metallic waveguides. Fundamental guided-wave properties will be investigated. Novel theoretical techniques will be studied and developed, and experimental prototypes will be made and demonstrated for antennas, circuits and systems. This project will foster substantial interests of this new technology for future millimetre-wave and terahertz system development towards complete hybrid and monolithic system-on-substrate integration and miniaturization. The applicant, his students and research associates are eager to make a comprehensive characterization and quick development of this revolutionary technology. This research is strategically important for future explorations and applications in the field of information and communication technology. It will allow the applicant to further expand one of the most visible Canadian research programs in the world.
拟议的研究旨在调查和探索一种称为“衬底集成电路(SICs)”的新兴和颠覆性技术,以发展毫米波和太赫兹集成电路(MTICs)。SIC的这一概念是由申请人在十多年前首创的。基片集成波导(SIW)属于集成电路家族,在申请人的领导下,世界各地的研究人员已经广泛研究并成功探索,用于开发新一代微波和毫米波集成电路和系统。集成电路的基本特征是几乎所有的非平面导波结构都可以合成并以低成本转换为平面形式,从而使这种结构的完全集成成为可能。因此,平面和非平面结构可以无缝集成,并由相同的加工技术制成。这个构建平台有望成为下一代毫米波和太赫兹系统的集成电路,并统一电子学和光子学的物理机制。这项研究使申请人能够继续在发现新的电路功能,新的设计规则,新的创新器件和新的应用领域方面进行领先的国际研究。这将涉及非传统的多层基板和混合的介质金属波导。将研究基本的导波特性。将研究和开发新的理论技术,并为天线,电路和系统制作和演示实验原型。该项目将促进对这种新技术的实质性兴趣,用于未来毫米波和太赫兹系统的发展,以实现完全的混合和单片衬底上系统集成和小型化。申请人、他的学生和研究人员都渴望对这项革命性技术进行全面的表征和快速发展。这项研究对信息和通信技术领域的未来探索和应用具有重要的战略意义。这将使申请人能够进一步扩大世界上最引人注目的加拿大研究项目之一。

项目成果

期刊论文数量(0)
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会议论文数量(0)
专利数量(0)

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Wu, Ke其他文献

Hydrothermal solidification of diatomaceous earth with analcime formation
硅藻土的水热固化并形成方沸石
  • DOI:
    10.1007/s11164-012-0490-4
  • 发表时间:
    2012-02
  • 期刊:
  • 影响因子:
    3.3
  • 作者:
    Pan, LiLi;Jing, Zhenzi;Ishida, Emile Hideki;Wu, Ke;Zhou, Lei
  • 通讯作者:
    Zhou, Lei
Catalytic degradation of P-chlorophenol by muscovite-supported nano zero valent iron composite: Synthesis, characterization, and mechanism studies
  • DOI:
    10.1016/j.clay.2020.105735
  • 发表时间:
    2020-09-15
  • 期刊:
  • 影响因子:
    5.6
  • 作者:
    Bao, Teng;Damtie, Mekdimu Mezemir;Wu, Ke
  • 通讯作者:
    Wu, Ke
Millimeter-Wave Integrated Pyramidal Horn Antenna Made of Multilayer Printed Circuit Board (PCB) Process
Substrate Integrated Nonradiative Dielectric Waveguide Structures Directly Fabricated on Printed Circuit Boards and Metallized Dielectric Layers
直接在印刷电路板和金属化介电层上制造的基板集成非辐射介电波导结构
Galectin-9显著延长全球异基因的心移植物存活
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    6.2
  • 作者:
    He, Wentao;Du, Dunfeng;Chen, Zhonghua Klaus;Fang, Zemin;Hirashima, Mitsuomi;Yuan, Jin;Niki, Toshiro;Xu, Yi;Wang, Feng;Zhou, Hongmin;Gao, Ying;Zhang, Wei-Na;Wu, Ke
  • 通讯作者:
    Wu, Ke

Wu, Ke的其他文献

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{{ truncateString('Wu, Ke', 18)}}的其他基金

Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
  • 批准号:
    RGPIN-2017-06938
  • 财政年份:
    2022
  • 资助金额:
    $ 4.52万
  • 项目类别:
    Discovery Grants Program - Individual
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
  • 批准号:
    RGPIN-2017-06938
  • 财政年份:
    2021
  • 资助金额:
    $ 4.52万
  • 项目类别:
    Discovery Grants Program - Individual
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
  • 批准号:
    RGPIN-2017-06938
  • 财政年份:
    2020
  • 资助金额:
    $ 4.52万
  • 项目类别:
    Discovery Grants Program - Individual
NSERC/Huawei industrial research chair in future wireless technologies
NSERC/华为未来无线技术工业研究主席
  • 批准号:
    492883-2015
  • 财政年份:
    2020
  • 资助金额:
    $ 4.52万
  • 项目类别:
    Industrial Research Chairs
NSERC/Huawei industrial research chair in future wireless technologies
NSERC/华为未来无线技术工业研究主席
  • 批准号:
    492882-2015
  • 财政年份:
    2019
  • 资助金额:
    $ 4.52万
  • 项目类别:
    Industrial Research Chairs
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
  • 批准号:
    RGPIN-2017-06938
  • 财政年份:
    2019
  • 资助金额:
    $ 4.52万
  • 项目类别:
    Discovery Grants Program - Individual
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
  • 批准号:
    DGDND-2017-00003
  • 财政年份:
    2019
  • 资助金额:
    $ 4.52万
  • 项目类别:
    DND/NSERC Discovery Grant Supplement
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
  • 批准号:
    DGDND-2017-00003
  • 财政年份:
    2018
  • 资助金额:
    $ 4.52万
  • 项目类别:
    DND/NSERC Discovery Grant Supplement
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
  • 批准号:
    RGPIN-2017-06938
  • 财政年份:
    2018
  • 资助金额:
    $ 4.52万
  • 项目类别:
    Discovery Grants Program - Individual
NSERC/Huawei industrial research chair in future wireless technologies
NSERC/华为未来无线技术工业研究主席
  • 批准号:
    492883-2015
  • 财政年份:
    2018
  • 资助金额:
    $ 4.52万
  • 项目类别:
    Industrial Research Chairs

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Research and Development of Substrate Integrated Circuits and Systems for Gigahertz and Terahertz Electronics and Photonics
千兆赫和太赫兹电子和光子学衬底集成电路和系统的研究与开发
  • 批准号:
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    Discovery Grants Program - Individual
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千兆赫和太赫兹电子和光子学衬底集成电路和系统的研究与开发
  • 批准号:
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    Discovery Grants Program - Individual
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千兆赫和太赫兹电子和光子学衬底集成电路和系统的研究与开发
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  • 批准号:
    122137-2012
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  • 资助金额:
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