Searching for new Sn-Ag-Cu based lead free solders with low melting temperature using a thermodynamic modeling method

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AIM Solders is a Montreal-based company leading the global manufacturing of tin-lead and lead-free solders assembly materials for the electronics industry, which has a strong interest for the lead-free solders development. Solders play an important role in the materials industry especially in the electronic packaging applications [1, 2]. Lead (Pb) is the traditional alloying element in Sn-based solders, but is harmful to human health. So in the most important markets of the world (USA, China, EU, and Japan), new laws banning the use of Pb containing solders have been imposed. Therefore, the requirement of development lead-free solders is imperative. Current commercial lead-free solders are mainly based on Sn with several alloying elements (Ag, Cu, Bi, Ni, Zn, and Sb etc.). Sn-Ag-Cu alloys (like SAC305) are the most used lead-free solders. However, the main problem of Sn-Ag-Cu-based alloys is its relatively high first melting temperature (called eutectic temperature) in comparison with Sb-Pb solders. AIM Solders requires the assistance from our group to solve this problem and find compositions of Sn-Ag-Cu-X-Y multicomponent alloys with lower eutectic temperatures. The present project will be aimed at searching and designing new Sn-Ag-Cu-based solders with low eutectic temperature in an effective and operable way within a period of 5 months.