Numerical and Experimental Studies of Natural Convective Heat Transfer from Horizontal and Near Horizontal Plane Heated Surfaces of Various Shapes

许多非计算机相关设备中使用的电子元件需要冷却才能有效运行。虽然这种设备的冷却不会像计算机系统中出现的那样严重，但确保足够的热管理可能是具有挑战性的。这类部件，例如工业测量系统中的部件，由于其高可靠性和成本效益，通常通过自然对流冷却。适当的热管理需要了解在此类设备中出现的情况下存在的自然对流换热速率。这项研究计划旨在通过提供广泛的重要的新的基本信息来实现这一点，以用于此类冷却系统的设计。所考虑的情况是真实世界电子元件冷却中发生的情况的简化模型。组件将被建模为嵌入周围平面中的各种形状的平板受热元件，并且在大多数情况下，假定为水平的。

Electronic components used in many non-computer related devices require cooling in order to operate effectively. While cooling of such devices does not pose difficulties as severe as those arising in computer systems, ensuring adequate thermal management can be challenging. Such components, e.g. those in industrial measuring systems, are often cooled by natural convection due to its high reliability and cost effectiveness. Adequate thermal management requires knowledge of the natural convective heat transfer rates that exist in situations arising in such devices. This research program aims to accomplish this by providing a wide range of important new basic information for use in the design of such cooling systems. Situations considered are simplified models of those occurring in real-world electronic component cooling. Components will be modeled as flat heated elements of various shapes embedded in a surrounding flat surface, and in most cases, assumed to be horizontal.