Numerical and Experimental Studies of Natural Convective Heat Transfer from Horizontal and Near Horizontal Plane Heated Surfaces of Various Shapes

许多非计算机相关设备中使用的电子元件需要冷却才能有效运行。虽然这种设备的冷却不会像计算机系统中出现的那样严重，但确保足够的热管理可能是具有挑战性的。这类部件，例如工业测量系统中的部件，由于其高可靠性和成本效益，通常通过自然对流冷却。适当的热管理需要了解在此类设备中出现的情况下存在的自然对流换热速率。这项研究计划旨在通过提供广泛的重要的新的基本信息来实现这一点，以用于此类冷却系统的设计。所考虑的情况是真实世界电子元件冷却中发生的情况的简化模型。元件将被模拟为嵌入周围平面的各种形状的平板受热元件，并且在大多数情况下，假定为水平的。*建议的研究领域包括：*1在一系列元件形状存在层流、过渡流和湍流的情况下获得传热结果。将生成描述结果的实用方程。*2研究波浪形表面是否可以增加水平元件的换热速率。*3当多个水平元件靠近时，相邻表面上的流动可能发生相互作用，影响换热速率。将研究这种影响。*4研究元件表面存在的热条件对传热速率的影响。*5研究具有平行覆盖表面的水平元件的传热速率。*6研究元件与水平方向成小角度倾斜时的传热速率。*7确定如果传热发生在纳米流体而不是空气上，元件的传热速率是否可以增加。*研究结果将对涉及非计算机电子元件的工业系统的设计者具有相当大的价值。这些结果将为他们提供改进和更广泛的方法来估计传热率，这将使他们能够更准确地预测部件的运行温度。这将允许设计更有效和更低成本的系统，因此有可能提高加拿大在这一领域的工业竞争力。这些结果还将增进对所涉及的自然对流类型的基本知识。该研究项目涉及申请者及其研究小组具有丰富经验和专业知识的领域的工作。*参与这项研究的HQP将在涉及新的和具有挑战性的问题方面获得经验和技术专业知识，并在使用先进的数值和实验程序方面获得经验。他们将为在行业或学术界的职业生涯做好充分准备。**

Electronic components used in many non-computer related devices require cooling in order to operate effectively. While cooling of such devices does not pose difficulties as severe as those arising in computer systems, ensuring adequate thermal management can be challenging. Such components, e.g. those in industrial measuring systems, are often cooled by natural convection due to its high reliability and cost effectiveness. Adequate thermal management requires knowledge of the natural convective heat transfer rates that exist in situations arising in such devices. This research program aims to accomplish this by providing a wide range of important new basic information for use in the design of such cooling systems. Situations considered are simplified models of those occurring in real-world electronic component cooling. Components will be modeled as flat heated elements of various shapes embedded in a surrounding flat surface, and in most cases, assumed to be horizontal.***Proposed study areas, which involve numerical and experimental work, are:****1   Obtain heat transfer results for conditions where laminar, transitional and turbulent flow exists for a range of element shapes. Practical equations that describe the results will be generated.***2  Study whether wavy shaped surfaces can increase the heat transfer rate from a horizontal element.***3   When multiple horizontal elements are close together, interaction of the flows over adjacent surfaces can occur affecting the heat transfer rates. This effect will be studied.***4  Investigate the effect of thermal conditions existing at the element surface on the heat transfer rate.***5  Study the heat transfer rate from a horizontal element with a parallel shrouding surface over it.***6  Study the heat transfer rate when the element is inclined at a small angle to the horizontal.***7  Determine if the heat transfer rate from an element can be increased if heat transfer occurs to a nanofluid rather than air. ****The outcomes will be of considerable value to designers of industrial systems involving non-computer electronic components. These outcomes will provide them with improved and more extensive methods for estimating heat transfer rates which will allow the more accurate prediction of operating temperatures of the components. This will permit more efficient and lower cost systems to be designed and hence will potentially enhance Canada's industrial competitiveness in this field. The results will also advance basic knowledge of the type of natural convective flows involved. This research program involves work in an area in which the applicant and his research group have extensive experience and expertise. ****HQP involved in this research will gain experience and technical expertise in areas involving new and challenging problems and gain experience in the use of advanced numerical and experimental procedures. They will be well prepared for careers in either industry or academia.**