RF/Millimeter-wave multi-chip power amplifier module with antenna switch using advanced CMOS technologies

现代无线通信设备将需要以毫米波（mm-wave）频率工作；高效节能，因为电池寿命长；实现日益高速的数据传输；与多个天线一起操作，以增加其应用的通用性；而且要小。发射器前端模块为无线发射器中的天线提供高功率电平信号，将在实现上述定义的特性中发挥关键作用。****这项集成电路（IC）技术的研究解决了使用5 GHz载波信号的无线局域网（WLAN）通信能力和60 GHz毫米波通信能力共存的必要性，这给前端模块的集成设计带来了挑战。这需要半导体技术分区以及在不同功率水平下运行的电路设计技术，使用不同的半导体工艺。为了适应不同通信条件对60 GHz天线选择开关的需求，需要开发一种新型的低损耗CMOS交换网络。****该研究项目将有助于射频和毫米波IC功率放大器的发展，特别是在功率效率提高，CMOS晶体管击穿保护和CMOS开关功能方面，旨在解决上述毫米波前端模块的挑战。重点将放在芯片集成在先进的CMOS技术。该计划亦有助在École de technologie supersamrieure （ÉTS）培养高素质的研究人员，他们将掌握研究、设计和原型制作所需的技能，为加拿大无线通讯产业开发新的半导体和毫米波微系统设备**

Modern wireless communication equipment will be required to operate at millimeter-wave (mm-wave) frequencies; to be energy efficient because of battery life time; to enable increasingly high speed data transmission; to operate with multiple antennas for increased versatility in their applications; and to be small. The transmitter front-end module, which delivers the high power level signals to antennas in a wireless transmitter, will play a critical role in achieving the above defined characteristics.****This research on Integrated Circuits (IC) technology addresses the necessity for the coexistence of Wireless Local Area Network (WLAN) communication capabilities using 5 GHz carrier signals and mm-wave communication capabilities at 60 GHz, which imposes integration design challenges in the front-end module. This requires semi-conductor technology partitioning as well as circuit design techniques that operate at different power levels, using different semi-conductor processes. The need for a 60 GHz antenna selection switch to accommodate different communication conditions requires the development of a novel CMOS switching network with low losses.****This research project will contribute to the advancement of Radiofrequency & mm-wave IC power amplifiers, in particular in regard to power efficiency improvement, CMOS transistor breakdown protection and CMOS switching functions, intended to address the above-mentioned challenges for mm-wave front-end modules. Emphasis will be placed on chip integration in advanced CMOS technologies. The project will also contribute to the formation of highly qualified researchers at the École de technologie supérieure (ÉTS), who will master the skills required at the research, design, and prototyping levels for the development of new semiconductor and mm-wave Micro-Systems-based devices in the Canadian wireless communication industry.**