RF/Millimeter-wave multi-chip power amplifier module with antenna switch using advanced CMOS technologies

现代无线通信设备将被要求在毫米波(毫米波)频率下工作；由于电池寿命的原因而能源效率高；能够实现日益高速的数据传输；在其应用中使用多个天线以增加多功能性；以及小型化。将高功率电平信号传输到无线发射机天线的发射机前端模块将在实现上述特性方面发挥关键作用。*集成电路(IC)技术的研究解决了使用5 GHz载波信号的无线局域网(WLAN)通信能力与60 GHz毫米波通信能力共存的必要性，这对前端模块的集成设计提出了挑战。这需要半导体技术分区以及使用不同半导体工艺、在不同功率水平下运行的电路设计技术。为了满足不同通信条件对60 GHz天线选择开关的需求，需要开发一种低损耗的新型CMOS开关网络。*这项研究项目将有助于射频和毫米波IC功率放大器的发展，特别是在功率效率的提高、CMOS晶体管击穿保护和CMOS开关功能方面，旨在解决上述毫米波前端模块的挑战。重点将放在先进的CMOS技术中的芯片集成上。该项目还将有助于培养技术学院(ETS)的高素质研究人员，他们将掌握在加拿大无线通信行业开发新型半导体和毫米波微系统设备所需的研究、设计和原型水平的技能。**

Modern wireless communication equipment will be required to operate at millimeter-wave (mm-wave) frequencies; to be energy efficient because of battery life time; to enable increasingly high speed data transmission; to operate with multiple antennas for increased versatility in their applications; and to be small. The transmitter front-end module, which delivers the high power level signals to antennas in a wireless transmitter, will play a critical role in achieving the above defined characteristics.****This research on Integrated Circuits (IC) technology addresses the necessity for the coexistence of Wireless Local Area Network (WLAN) communication capabilities using 5 GHz carrier signals and mm-wave communication capabilities at 60 GHz, which imposes integration design challenges in the front-end module. This requires semi-conductor technology partitioning as well as circuit design techniques that operate at different power levels, using different semi-conductor processes. The need for a 60 GHz antenna selection switch to accommodate different communication conditions requires the development of a novel CMOS switching network with low losses.****This research project will contribute to the advancement of Radiofrequency & mm-wave IC power amplifiers, in particular in regard to power efficiency improvement, CMOS transistor breakdown protection and CMOS switching functions, intended to address the above-mentioned challenges for mm-wave front-end modules. Emphasis will be placed on chip integration in advanced CMOS technologies. The project will also contribute to the formation of highly qualified researchers at the École de technologie supérieure (ÉTS), who will master the skills required at the research, design, and prototyping levels for the development of new semiconductor and mm-wave Micro-Systems-based devices in the Canadian wireless communication industry.**