RF/Millimeter-wave multi-chip power amplifier module with antenna switch using advanced CMOS technologies

采用先进 CMOS 技术的带天线开关的射频/毫米波多芯片功率放大器模块

• 批准号: 505290-2016
• 负责人: Constantin, Nicolas
• 金额: $ 2.67万
• 依托单位: École de technologie supérieure
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=618747
• 关键词: RF; Millimeter; wave; multi; chip

Modern wireless communication equipment will be required to operate at millimeter-wave (mm-wave) frequencies; to be energy efficient because of battery life time; to enable increasingly high speed data transmission; to operate with multiple antennas for increased versatility in their applications; and to be small. The transmitter front-end module, which delivers the high power level signals to antennas in a wireless transmitter, will play a critical role in achieving the above defined characteristics.This research on Integrated Circuits (IC) technology addresses the necessity for the coexistence of Wireless Local Area Network (WLAN) communication capabilities using 5 GHz carrier signals and mm-wave communication capabilities at 60 GHz, which imposes integration design challenges in the front-end module. This requires semi-conductor technology partitioning as well as circuit design techniques that operate at different power levels, using different semi-conductor processes. The need for a 60 GHz antenna selection switch to accommodate different communication conditions requires the development of a novel CMOS switching network with low losses.This research project will contribute to the advancement of Radiofrequency & mm-wave IC power amplifiers, in particular in regard to power efficiency improvement, CMOS transistor breakdown protection and CMOS switching functions, intended to address the above-mentioned challenges for mm-wave front-end modules. Emphasis will be placed on chip integration in advanced CMOS technologies. The project will also contribute to the formation of highly qualified researchers at the École de technologie supérieure (ÉTS), who will master the skills required at the research, design, and prototyping levels for the development of new semiconductor and mm-wave Micro-Systems-based devices in the Canadian wireless communication industry.

现代无线通信设备将需要在毫米波（mm波）频率下工作;由于电池寿命长，因此能源效率高;能够实现越来越高的数据传输速度;使用多个天线工作，以增加其应用的多功能性;并且体积小。发射机前端模块向无线发射机中的天线提供高功率电平信号，将在实现上述定义的特征方面发挥关键作用。这项对集成电路（IC）技术的研究解决了无线局域网（WLAN）共存的必要性使用5 GHz载波信号的通信能力和60 GHz的毫米波通信能力，这在前端模块中强加了集成设计挑战。这需要半导体技术划分以及在不同功率水平下工作的电路设计技术，使用不同的半导体工艺。60 GHz天线选择开关需要适应不同的通信条件，需要开发一种新型的低损耗CMOS开关网络。本研究项目将有助于提高射频和毫米波集成功率放大器的功率效率，特别是在提高功率效率，CMOS晶体管击穿保护和CMOS开关功能方面。旨在解决毫米波前端模块的上述挑战。重点将放在先进的CMOS技术的芯片集成。该项目还将有助于在高等技术学院（ÉTS）形成高素质的研究人员，他们将掌握在加拿大无线通信行业开发新的半导体和毫米波微系统设备的研究，设计和原型设计水平所需的技能。