Toward a New Generation of Additively Manufactured Heat Exchange Technologies

该发现研究计划的愿景是促进新一代热传递技术的开发，该技术利用高性能聚合物复合材料(PC)和添加剂制造(AM)方面的最新科学和技术进步。这将使我们能够创造和优化一种全新的轻便、高性能的两相热虹吸管、热管和热交换器。 AM与用于热传递应用的PC的结合提供了一个令人兴奋的机会，既可以利用高导电性PC提供的特殊材料性能的潜力，也可以利用AM提供的独特制造可能性然而，这些新材料和制造方法的发展与对其相关热物理的基本理解之间存在着明显的差距。 该计划的长期目标是对添加制造的聚合物复合材料(AM-PC)固体和结构中的热传输机制有一个基本的了解。未来5年将解决的短期目标是： 1.表征AM-PC结构的有效导热系数，建立预测其力学性能和热性能的理论模型。 2.了解和控制AM-PC表面几何形状的特征，以预测和减少接触热阻，并了解AM-PC之间的工质-表面相互作用，因为它们与AM-PC在两相换热器中的使用有关。 3.表征AM-PC表面的沸腾换热，并开发预测模型和新的沸腾强化技术，这些技术是AM提供的材料和制造可能性所独有的 这项研究计划将是多学科的，将结合热流体科学、材料表征和AM在热传递应用中的应用。它将全面了解与AM-PC相关的重要热传递机制和现象，并有助于开发新一代紧凑型、高性能和轻量化的热传输、交换和转换技术，以满足加拿大汽车、航空航天、电信和移动设备等行业的需求。对于这些行业，必须在所有部件都有严格的重量限制的情况下实现热目标，包括热交换器。轻便的两相AM-PC热交换器为极其紧迫的问题提供了一种创新的解决方案。 该计划还将为加拿大的高科技行业培养和发展急需的高素质人才(HQP)。

The vision for this Discovery Research Program is to enable the development of a new generation of heat transfer technologies which leverages the recent scientific and technical advances in both high-performance polymer composites (PCs) and additive manufacturing (AM). This will enable the creation and optimization of an entirely new class of lightweight, high performance, two-phase thermosyphons, heat pipes, and heat exchangers. The combination of AM with PCs for heat transfer applications presents an exciting opportunity to leverage the potential of both the exceptional material properties offered by high conductivity PCs and the unique fabrication possibilities offered by AM. However, there is a distinct gap between the development of these new materials and fabrication methods and a fundamental understanding of their associated thermal physics. This program's long-term goal is to develop a fundamental understanding of thermal transport mechanisms in and on additively manufactured polymer composite (AM-PC) solids and structures. The short-term objectives that will be addressed in the next 5 years are: 1. To characterize the effective thermal conductivity of AM-PC structures and to develop theoretical models for predicting their mechanical and thermal behaviour. 2. To understand and control the characteristics of AM-PC surface geometries for the prediction and mitigation of thermal contact resistance and to understand working fluid-surface interactions between AM-PCs as they pertain to their use in two-phase heat exchangers. 3. To characterize boiling heat transfer on AM-PC surfaces and develop predictive models along with novel boiling enhancement techniques that are unique to the materials and fabrication possibilities afforded by AM. This research program will be multidisciplinary and will combine thermal fluid sciences, materials characterization, and AM for heat transfer applications. It will yield a comprehensive understanding of the important heat transfer mechanisms and phenomena associated with AM-PCs and help enable the development of a new generation of compact, high-performance, and lightweight heat transport, exchange, and conversion technologies to meet the needs of Canadian industries such as automotive, aerospace, telecoms, and mobile devices. For these industries, thermal targets must be achieved with severe weight constraints on all parts, including heat exchangers. Lightweight, two-phase AM-PC heat exchangers offer an innovative solution to an extremely pressing problem. This program will also train and develop much-needed highly qualified personnel (HQP) for Canada's high-tech industries.