Zwitterionic bottlebrush elastomers for bioelectronics

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Advances in implantable bioelectronics are changing our understanding and treatment of neurological disorders. For example, commercial ventures like Neuralink and Kernel are realizing ultra-high-bandwidth brain-machine interfaces with fiber-like flexible probes. Because chronic implantation is needed for lifelong disorders, it is important to consider strategies to mitigate the immunological responses that lead to device failure. One approach to improving tissue compatibility is to reduce the mechanical rigidity of devices by using low bending stiffness architectures or lower-modulus materials, but these efforts have not matched the moduli of soft biological tissue. Consider the softness of your lips to the electronics in your mobile phones-- you can intuitively discern a large difference in softness and stretchability. There have been advances in making electronic materials with a good mechanical match to biological tissue; one example is a class of material called hydrogels. However, hydrogels contain substantial water, which complicates electronic performance and device fabrication (e.g., it is difficult to adhere wet layers together). Also, there have been advances in making materials that are effectively stealth to our immune system through precise chemical functionalities, delaying and avoiding device failure. These materials are non-fouling or effectively mimic the natural milieu, avoiding the cascade of immunological events that leads to fibrotic capsule formation and device failure. However, chemical strategies alone are insufficient for long-term implantation of devices. Currently, an integrated materials platform that exploits both mechanical and chemical approaches does not exist and poses as a potential solution for extending implantation time. There work described herein is a collaborative effort between a chemist and physicist to synthesize ultrasoft materials that are non-fouling and subsequently characterize their mechanical properties to design the next generation of coatings for implantable devices.