Multi-user and low-cost silicon interposer platform for bio/quantum systems

全球向数字化社会的过渡使数十亿人在日常活动中使用微电子技术。对小型化、速度和可靠性的日益增长的需求必须通过多个微芯片的紧凑组合来满足。技术限制正在迅速超越传统电路板的能力。因此，硅中介层，一种用于集成多种芯片的高成本、高性能的封装解决方案，在研究和商业化中得到了普及。该提案将开发并证明加拿大制造的第一个低成本、可访问的硅中介层技术。该提案团队包括来自Université de Sherbrooke，Polytechnique Montréal，Université拉瓦尔和多伦多大学的研究人员以及行业合作伙伴CMC Microsystems，SBQuantum和Xanadu，将在插入器上开发超紧凑系统，以推进生物医学传感和量子技术的最新发展。由于该项目，加拿大已建立的插入器供应链，包括国家创新设施和大学实验室，将继续提供这一关键工具，以促进不断增长的数字经济，并提高加拿大10，000多名微系统开发人员的国际竞争力。

Global transition to a digital society has billions using microelectronic technology in their day-to-day activities. The increasing demand for miniaturization, speed, and reliability must be satisfied with a compact combination of multiple microchips. The technical constraints are quickly surpassing the capabilities of conventional circuit boards. Thus, silicon interposers, a high-cost, high-performance packaging solution for integrating multiple kinds of chips, have gained popularity in research and commercialization. This proposal will develop and prove the first low-cost, accessible silicon interposer technology made-in-Canada. The proposal team, involving investigators from Université de Sherbrooke, Polytechnique Montréal, Université Laval, and University of Toronto and industry partners CMC Microsystems, SBQuantum, and Xanadu, will develop ultra-compact systems on interposer to advance the state of the art in biomedical sensing and quantum technology. As a result of this project, an established Canadian supply chain for interposers, involving national innovation facilities and university labs, will continue delivering this critical tool to enable the growing digital economy and to boost international competitiveness for over 10,000 microsystems developers in Canada.