Market Assessment: Teflon Metallization

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Thin films of Polytetrafluoroethylene, PTFE (known by its commercial name Teflon) is known for its high thermal resistivity and environmental stability. It has high melting temperature of close to 400C and flame resistivity, is chemically inert (not affected by majority of solvents), and has high flexural strength. However, due to its hydrophobicity, low coefficient of friction, and low surface energy, conductive metals do not adhere to it. University of Waterloo (UW) researchers have developed a technology to deposit a thin dense layer of a dielectric which can subsequently be used for printing any metal such as silver and copper. The invention removes hydrophobicity properties and enables metallization of Teflon. Some main advantages of this invention include: 1) has high throughput; 2) does not affect flexibility, electrical or thermal resistance of Teflon; 3) can work with any material (e.g., metals and ceramics); 4) compatible with required processing temperature of Teflon.This system can be used in any application where high temperature performance and/or flexibility of substrate is required. Existing systems are typically complex, limited to specific coating material, use toxic chemicals, and pose harm to environment.As part of this Market Assessment grant, the selected consultant will perform a thorough market analysis to identify the most suitable market opportunities along with technical challenges associated with the application of the technology in a particular market segment. A favorable market assessment result will further guide the development of a commercialization strategy and in attracting investments.