Synergistic Evolution from 2D to 3D Printed Electronics with Versatile Nano-composite Material Systems

多功能纳米复合材料系统从 2D 到 3D 印刷电子的协同进化

• 批准号: RGPIN-2016-04334
• 负责人: Kim, WooSoo
• 金额: $ 3.13万
• 依托单位: Simon Fraser University
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2022
• 资助国家: 加拿大
• 起止时间: 2022-01-01 至 2023-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=760561
• 关键词: Synergistic; Evolution; 2D; 3D; Printed

Advanced printing techniques with integrated processes for printed electronics on a flat flexible substrate by using direct roll-to-roll transfer of organic functional ink materials have been demonstrated during the tenure of my first Discovery project. Specially, thin film devices including organic field effect transistors, flexible pressure and strain sensors have been investigated as 2D printed electronics. 2D electronic systems are reliable, fast, and potentially cost-effective. But the limitation of these technologies is that they can deposit conductive materials only on flat substrates, though flexible circuits are also possible by later deforming the flat substrate. I believe that 3D printing is natural progression of my 2D printing research for the next five years. 3D printing directly produces devices embedded within 3D structural materials. Especially, I will identify specific research challenges in multi-materials 3D printing and high-resolution 3D printed electronic devices in which functional nano-materials might lead to a step change in technology or performance. Also, addressing such challenges will necessitate the combination of 2D printing and 3D printing technologies. The proposed program aims to solve a number of 3D printing's technical problems such as multi-materials deposition and high-resolution device fabrication that have hindered broader adoption of the high-tech manufacturing process. The next phase of 3 D printing allows it to “build” or “grow” functional circuits in layers, by using various materials. The 3D printing industry experienced a huge growth, in turn increasing the need for the 3D printing of functional materials. In this research program, I will create 3D printed highly conductive alloy metals, and metal nano-composites with silver nanowires or graphene for 3D integrated applications. This program will also create a platform for a 3d printer system that combines three different deposition methods including Fused Filament Fabrication, Liquid Viscous Ink Extrusion, and Aerosol Spray. Filament and Ink materials will be designed and optimized as 3D printable versatile materials with functional fillers such as highly conductive nano-materials for the development of suitable 3D conductive/electrical printing technologies. Special ink properties, such as shear-thinning (thixotropic) rheology are another key objective in this program to enhance the printability through the narrow extrusion system and to keep the ink in-shape after printing. By successful demonstration of the synergistic combination of 2D and 3D printed electronics, 3D multi-material printing will become achievable for manufacturing technology which offers a new paradigm in the 3D integration of sensors or complex electronics within a single build process, promoting simple and low-cost electronics.

在我的第一个Discovery项目的任期内，通过使用有机功能油墨材料的直接卷到卷转移，在平面柔性基板上展示了先进的印刷技术和集成的印刷电子工艺。特别是作为二维印刷电子学的薄膜器件，包括有机场效应晶体管、柔性压力和应变传感器等。2D电子系统可靠、快速，而且具有潜在的成本效益。但这些技术的局限性在于，它们只能在平板基板上沉积导电材料，尽管柔性电路也可以通过稍后对平板基板进行变形来实现。我相信3D打印是我未来五年2D打印研究的自然发展。3D打印直接生产嵌入3D结构材料中的设备。特别是，我将确定多材料3D打印和高分辨率3D打印电子设备的具体研究挑战，在这些设备中，功能纳米材料可能会导致技术或性能的阶段性变化。此外，解决这些挑战将需要2D打印和3D打印技术的结合。拟议的计划旨在解决3D打印的一些技术问题，如多材料沉积和高分辨率设备制造，这些问题阻碍了高科技制造工艺的更广泛采用。3D打印的下一阶段允许它通过使用不同的材料，在一层一层地“建造”或“生长”功能电路。3D打印行业经历了巨大的增长，反过来又增加了对功能材料的3D打印的需求。在这个研究项目中，我将创造3D打印的高导电合金金属，以及用于3D集成应用的银纳米线或石墨烯的金属纳米复合材料。该计划还将为3D打印机系统创建一个平台，该系统结合了三种不同的沉积方法，包括熔丝制造、液体粘性墨水挤压和气雾剂喷雾。灯丝和油墨材料将被设计和优化为3D可打印的多功能材料，并使用高导电纳米材料等功能填充物，以开发合适的3D导电/电子打印技术。特殊的油墨性能，如剪切稀化(触变)流变性是该计划的另一个关键目标，旨在通过窄挤压系统增强印刷适宜性，并在印刷后保持油墨的形状。通过成功展示2D和3D打印电子技术的协同组合，3D多材料打印将成为制造技术的实现，这将为单一制造过程中传感器或复杂电子设备的3D集成提供新的范例，促进简单和低成本的电子产品。