Synergistic Evolution from 2D to 3D Printed Electronics with Versatile Nano-composite Material Systems

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Advanced printing techniques with integrated processes for printed electronics on a flat flexible substrate by using direct roll-to-roll transfer of organic functional ink materials have been demonstrated during the tenure of my first Discovery project. Specially, thin film devices including organic field effect transistors, flexible pressure and strain sensors have been investigated as 2D printed electronics. 2D electronic systems are reliable, fast, and potentially cost-effective. But the limitation of these technologies is that they can deposit conductive materials only on flat substrates, though flexible circuits are also possible by later deforming the flat substrate. I believe that 3D printing is natural progression of my 2D printing research for the next five years. 3D printing directly produces devices embedded within 3D structural materials. Especially, I will identify specific research challenges in multi-materials 3D printing and high-resolution 3D printed electronic devices in which functional nano-materials might lead to a step change in technology or performance. Also, addressing such challenges will necessitate the combination of 2D printing and 3D printing technologies. ***The proposed program aims to solve a number of 3D printing's technical problems such as multi-materials deposition and high-resolution device fabrication that have hindered broader adoption of the high-tech manufacturing process. The next phase of 3 D printing allows it to “build” or “grow” functional circuits in layers, by using various materials. The 3D printing industry experienced a huge growth, in turn increasing the need for the 3D printing of functional materials. In this research program, I will create 3D printed highly conductive alloy metals, and metal nano-composites with silver nanowires or graphene for 3D integrated applications. This program will also create a platform for a 3d printer system that combines three different deposition methods including Fused Filament Fabrication, Liquid Viscous Ink Extrusion, and Aerosol Spray. Filament and Ink materials will be designed and optimized as 3D printable versatile materials with functional fillers such as highly conductive nano-materials for the development of suitable 3D conductive/electrical printing technologies. Special ink properties, such as shear-thinning (thixotropic) rheology are another key objective in this program to enhance the printability through the narrow extrusion system and to keep the ink in-shape after printing. By successful demonstration of the synergistic combination of 2D and 3D printed electronics, 3D multi-material printing will become achievable for manufacturing technology which offers a new paradigm in the 3D integration of sensors or complex electronics within a single build process, promoting simple and low-cost electronics.**