石墨烯增强铜基复合材料被认为是一种十分具有潜力的高强度、高导电性的铜材料。本项目针对石墨烯在金属基体中分散性差和石墨烯-金属基体界面结合强度低的问题，通过累积叠轧制备超细晶graphene/Cu复合材料，改善和提升材料的综合性能。研究累积叠轧过程中超细晶结构和层界面组织的形成和演化规律，揭示超细晶结构的晶粒细化机制和变形机制；研究其硬度和拉伸性能及破坏形式，探索累积叠轧过程中大塑性变形和石墨烯对材料硬度和强度的影响规律，结合微观组织分析，阐明超细晶graphene/Cu材料的强化机制。构建ARB制备工艺-微观结构演化-变形机制-力学行为-强化机制之间的内在联系，探索改善graphene/Cu复合材料力学性能的途径。为研发新型高性能铜基复合材料提供必要的理论依据和技术储备。

Graphene reinforced copper matrix composites have been considered as the potential copper materials with high strength and high conductivity. Up to now very limited studied have been focused on the graphene/metal composite materials, because of the difficulty of dispersion and interfacial bonding. Here, the ultra-fine grain graphene/Cu composites were fabricated by accumulative roll bonding (ARB). Microstructure evolution and interfacial bonding of ultra-fine grain graphene/Cu composites were studied in order to reveal grain refinement mechanism and deformation mechanism. Microhardness and tensile behavior were investigated to described the effects of severe plastic deformation and grapheme on the strengthening mechanism. Combination properties of graphene/Cu composites were increased by building relationships of ARB process, microstructure, mechanical properties. It is of great significances in theory and practice to develop the new type of copper matrix composites.