柔性基板精细导电线路的加成法制备及可靠性研究

To solve the technical problems of the subtractive preparation method of fine lines used on the COF flexible packaging substrate, we proposed an additive preparation process based on ink-jet printing in this project. Solution-based ink is ink-jet printed on flexible substrates and patterns with catalytic activity will be obtained. The copper conductive layer will be obtained after limited and controlled catalytic deposition. Aiming at the application requirement of "easy-to-print ink, high-temperature-free process", we will study the fluid dynamics of the ink, the jet and efflux dynamics of the ink droplets, and the low-temperature deposition controlling method of metal wires on the surface of flexible substrates, and optimize the electrical properties of fine conductive lines on flexible substrates; Aiming at the application requirement of "high precision", we will study the droplet characteristics and its ejection state controlling technology, high-precision digital graphics transfer technology, the droplet-substrate interface behavior, and catalytic growth dynamics and controlled catalytic mechanism of metals to achieve flexible conductive circuits with high precision additive method; Aiming at the application requirement of "reliability", the mechanical model of fine lines under flexible deformation is set up to study the failure mechanism and discuss the binding force enhancing method between conductive films and substrates. The relationship between copper layer feature size and its electrical and mechanical performances are also discussed to obtain highly reliable conductive line preparation technology. The research project will lay theoretical and experimental foundation for the development of flexible electronics industry and innovation of related scientific issues.

项目针对目前COF柔性封装基板精细线路减成法制备中的技术瓶颈问题，提出了一种基于喷墨印刷的加成法制备技术：将溶液型油墨喷墨印刷在柔性基上形成具有催化活性的线路图形，再经受限控制催化沉积获得铜导电功能层。项目将瞄准"油墨易喷印、无高温过程"的应用需求，研究油墨的流体动力学特性、墨滴射流动力学、柔性基表面金属低温催化沉积的生长控制方法，优化柔性基上精细线路的电学性能；瞄准"高精度"的应用需求，研究墨滴特性与喷射状态控制技术、高精度数字图形转移技术、墨滴/基板界面行为、金属催化沉积动力学和受限控制催化机理，实现柔性基导电线路加成法高精度制备；瞄准"可靠性"的应用需求，建立精细线路在柔性变形下的力学模型并研究其失效机理、探讨导电膜层与基板的结合力提升手段、铜层特征尺寸与其电学及力学性能的关系，获得高可靠性导电线路制备技术。项目研究将为我国柔性电子产业的发展及相关科学问题的创新奠定理论和实验基础。

项目瞄准“油墨易喷印、无高温过程”的应用需求，研究了“溶液型”喷印墨滴射流及非牛顿流体柔印油墨动力学特性、柔性基表面金属低温催化沉积的动力学和受限控制催化机理，建立了水基可喷印油墨及柔版印制油墨配方体系，进一步提升了柔性基印制导电线路的电学性能；瞄准“高精度”应用需求，研究了墨滴特性与喷射状态控制技术，开发了柔版油墨高精度传墨及UV快速固化技术，提出了基于激光打印的高精度数字图形转移技术，建立了柔版印制“卷对卷”（R2R）实验平台，实现了多种柔性基板导电线路高精度印制制备；瞄准“可靠性”的应用需求，建立了精细线路在柔性变形下的力学模型并研究其失效机理、开发了多种柔性基板表面/界面化学增强技术，探讨了导电膜层与基板的结合力提升手段、铜层特征尺寸与线条延展性及抗弯曲性能的关系，获得了高可靠性导电线路制备技术。.项目解决了可印制高催化活性油墨体系构建、多种柔性基板界面化学性质增强设计方法、高催化活性种子层的动力学形成机制及控制方法、以及约束性化学沉积受限控制催化机理等关键科学问题；建立了喷墨印制、柔版印制、激光打印印制实验平台；获得了接近工业化应用的可喷墨印制活性油墨配方体系、可柔版印刷活性油墨体系；在PI、纸、柔性环氧、PET等多种柔性基板上实现了高精度、高附着及高弯折可靠性的导电线路印制制备；此外，项目还开展了基于项目技术所制备的导电线路在RF通讯器件、抗EMI材料及高灵敏度湿度阵列化传感器方面的研究，部分产品已完成批量化R2R制备性能验证，正在产业应用转化中。.四年来，项目研究成果已发表SCI论文14篇（其中JCR一区论文6篇，JCR二区论文5篇，1篇论文入选JMC2016年度热点论文库。所发表论文目前SCI他引已达150余次，单篇他引已达29次）；申请中国发明专利4项；项目已培养硕士研究生11名（其中2人获得优秀研究生“国家奖学金”，1人获评四川省优秀毕业生）；项目研究成果应邀在第7届全国柔性与印刷电子研讨会上做大会报告。

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