当一层比较硬的薄膜被封闭在上下两层柔性层中，组成了一个三层材料结构系统。这样的三层结构一方面可以提高集成电路的粘结性，另一方面可降低薄膜层的应变水平，使其具有较好的弯曲性能。这是因为相对于两层材料组成的集成电路，三层材料组成的集成电路在受弯的情况下可以使中性层偏移到中间的薄膜层上，从而使其的应变大大降低。然而，在压应力的作用下，可能会发生界面屈曲失稳。本课题拟采用理论分析、数值计算和实验验证相结合的方法，旨在发展能有效预测三层线弹性和neo Hookean材料系统中产生界面屈曲的模型，主要针对正弦屈曲模态，揭示单向和双向界面屈曲行为随主要特征几何参数和材料参数的变化规律，评估结构系统中几何参数(各层厚度)和材料参数（弹性模量，泊松比等因素）和材料常数沿厚度方向的变化对屈曲产生的条件与屈曲模态的影响，确定屈曲平衡状态下波幅，从而为可拉伸，尤其可弯曲集成电路的设计和应用提出指导性意见。

A stiff film is encapsulated between two compliant layers, which comprises an elastic sandwich system. In the fabrication of stretchable and foldable devices, such sandwich system is of particular importance. To avoid delamination of the circuit (film/layer system) and/or fracture of interconnects (film) under high bending, an additional encapsulating layer is introduced on top of the circuit to improve adhesion and alleviate the strain level because such layer/film/layer sandwich system shifts the neutral mechanical plane to the film plane. However，under applied compressive stress, the film may form buckles. The proposal aims to develop theoretical and numerical models for prediction of possible sinusoidal interfacial wrinkling in the sandwich elastic and neo Hookean material systems due to linear perturbation analysis and symplectic analysis. The experimental verification will be performed. The critical membrane stress, wave number and equilibrium amplitude for the onset of 1D and 2D interfacial wrinkles will be determined. The effect of characteristic geometrical parameters (thicknesses of the layers), material parameters (moduli and Poisson’s ratios) of the compliant layers and the gradient variation of material constants along the thickness on the wrinkling will be evaluated in detail. The results are expected to be helpful to design and use of sandwich stretchable, especially foldable circuit system.