金刚石/金属基复合材料是新一代电子封装材料的研究热点，核心是如何提高材料的导热性能，目前国内外主要研究思路是增加金刚石颗粒含量和改善金刚石颗粒/金属的复合界面，均取得了较好的效果。然而，此种结构中的金刚石颗粒（热导率1800-2200W/mK）犹如一座座由金属（Al-237W/mK、Cu-398W/mK）连接的导热孤岛，既增加了两相界面数量，又难产生协同作用，使金刚石优异的导热性能难以充分发挥。本项目的创新思路是在复合材料中构建连续的金刚石网络骨架，变高导热孤岛为高导热通道。具体研究思路为：以泡沫铜为衬底，利用CVD技术制备高质量金刚石网络骨架，再利用压力熔渗技术与铝复合，使金刚石与铝形成网络互穿结构，结合实验测试和理论分析，研究金刚石/铝网络互穿结构及其界面对复合材料导热性能的作用机理，准确建立其构-效关系，为高导热、低热膨胀、低密度金刚石/金属基复合材料的设计与制备提供理论和实验依据。

Diamond/metal composites have gained great prevalence as new-generation electronic packaging materials, whose core is how to improve their thermal conductivity. Nowadays, increasing the content of diamond particles and promoting the interface of these components are quite attractive, and some considerable results have also been obtained. But the high-thermal-conductivity diamond particles (1800~2200 W/mK) in these composites are just like isolated island connected by the metals with low thermal conductivity (240W/mK and 400W/mK for Al and Cu, respectively), which not only increases the number of interfaces, but also makes it hard to form synergy, impairing the extraordinary thermal conductivity of diamond. The innovation of this project is to establish continuous diamond network skeletons, turning the isolated islands into high heat conduction channels. The detailed research approach is described below. High quality diamond network skeleton will be firstly deposited on foamy copper by chemical vapor deposition, and subsequently composited with Al by pressure infiltration technique, forming interpenetrated network structures. Combining experimental data and theoretical analysis, the working mechanism of interpenetrated network structures and successive interface on thermal conductivity of composites will then be studied, establishing the relationship between materials structure and performance. Finally this research will provide theoretical and experimental basis for the design and fabrication of diamond/metal composites with low density, low thermal expansion coefficient and high thermal conductivity.