具有热缩冷胀特性的聚芳基酰胺功能材料的设计合成及机理研究

具有热缩冷胀(负热膨胀系数)特性的材料在自然界中是非常罕见的，尤其是具有负的热膨胀系数的聚合物。2013年我们与加利福尼亚大学Merced分校的Jennifer Lu教授合作，首次发现了一类具有负的热膨胀系数的聚芳基酰胺材料，由该聚合物制备的薄膜具有快速的热和光响应性能，而且性能优异，相关文章发表在2013年的Nat. Chem. (2013, 5, 1035-1041)和2014年的Adv. Funct. Mater. (2014, 24, 77-84)上。本申请目标是针对已发现的热收缩体系进行深入及拓展研究，主要解决以下几个核心科学问题：1、热收缩（负热膨胀）发生的机理；2、影响热收缩的关键因素；3、新的热缩聚合物的设计路径；4、该类体系的潜在应用方向，如制备可调变热膨胀系数材料（用于微电子芯片封装）、热及光敏感能源材料及相关敏感元件等。并以此为基础，探索发展新的热收缩聚合物体系。

The natural materials with thermal contraction (negative thermal expansion coefficient) are very rare, especially for polymer materials. In 2013, we, collaborated with Prof Jennifer Lu of University of California at Merced, discovered a new type of polyarylamide with large negative thermal expansion coefficient for the first time. The polymer film prepared by this new type material could respond to low-energy stimuli such as heat or NIR (near infrared) light. The related results have been published in Nat. Chem. (2013, 5, 1035-1041) and Adv. Funct. Mater. (2014, 24, 77-84). This application will deep the investigation of the thermal contraction system, and will resolve the following core scientific problems: (1) Discovering the molecular orgin of the thermal contraction; (2) The effect of preripheral parameters on the negative thermal expansion; (3) Route for design of new thermal contraction polymers; (4) Potential applications of this new system, such as the materials with tunable thermal expansion coefficient for chip packaging; new thermo-mechanoresponsive materials for fluctuating thermal waste harvesting and the core materials for remote sensors. In additin, new thermal expansion polymers should be explored.