随着电子器件向小尺寸、高密度发展，传统钎焊接头呈现出明显的局限性。Ag修饰石墨烯增强Sn-Ag-Cu钎料(SAC/Ag-GNSs)虽能增加强度并抑制界面金属间化合物(IMC)的生长，但回流焊过程中存在石墨烯上浮及IMC的过度生长等问题。本研究采用瞬态电流辅助键合实现SAC/Ag-GNSs钎料与基板的连接以解决上述问题。研究瞬态电流辅助键合条件下石墨烯在基体中的分布情况及强化机理、在熔融钎料中石墨烯上浮的动力学行为、石墨烯团聚程度对焊点力学性能的影响及体系的界面反应机理，建立工艺-钎焊接头微观组织-性能的定量关系。考虑钎焊接头的组织不均匀性、服役过程中焊点和IMC层的微观组织粗化长大、石墨烯的强化和团聚，构建蠕变本构方程; 发展寿命-性能指标-界面组织-工艺调控的钎焊结构链条式完整性评估技术。

With the development of micro devices towards miniturization, high density, SnAgCu(SAC) lead-free solder joints increasingly face obvious limitations. Although the addition of Ag-GNSs into SAC can improve the strength and retard the growth of IMC. The floating of GNSs and overgrowth of IMC during reflow process still exist. In the present study, the ultrafast current assisted bonding technology will be used to bond the SAC/Ag-GNSs with Cu substrate to solve the problems above mentioned. According to the Cu/SAC/Ag-GNSs soldering system, the distribution of GNSs and strengthening mechanism, dynamic behavior of GNSs floating, effect of GNSs agglomeration to mechanical properties, and the mechanism of interfacial reaction will be investigated under different ultrafast current assisted bonding procedure paramenters. The relationship between bonding parameters, microstructure and properties of solder joints will be studied. A new creep constitute model considering microstructure inhomogeneity and coarsening of IMC layer in solder joints, graphene strengthening mechanism and agglomeration during service will be proposed. Finally, soldering structure integrity assessment technology consisting life-performance index-inferface microstructure-procedure control will be developed.