多重功能纤维基柔性电子皮肤的结构、性能与工作机制研究

智能制造、国防军工等国家战略产业的快速发展对能够高效感知和分辨压力、温度和湿度多重刺激的柔性电子皮肤提出了迫切需求。本项目拟通过纤维、纱线和织物形态结构的创新，探索能够分别对压力、温度和湿度刺激产生分级可逆变化的多级导电通路结构的构造方法，构建在宽刺激区间内传感灵敏度高、响应速率快、性能稳定且抗干扰的电阻式纤维基柔性压力、温度和湿度离散传感单元，揭示导电材料及其通路的结构演变过程和电阻变化规律；设计将多重离散传感单元、信号采集电极和信号线编织集成的新方法，构筑具有三维柔顺性和舒适性，能在大面积内实现多重传感功能的纤维基柔性电子皮肤，揭示复杂应力、温湿度刺激在各离散传感单元中的传递机制、分布规律和抗干扰机制；建立多重功能纤维基柔性电子皮肤的结构与性能间的关系，阐明多重离散传感单元的协同机制和工作机理。本项目将为高性能柔性电子皮肤的研究提供新的思路，并为其宏量制备和广泛应用提供理论和技术支撑。

The rapid development of national strategic industries, such as intelligent manufacturing and national defense industries, has placed an urgent need on flexible electronic skins that can efficiently sense and distinguish multiple stimuli of pressure, temperature and humidity. This project intends to explore the construction methods of multi-level conductive path structures that can produce hierarchical and reversible changes to pressure, temperature and humidity stimuli through innovations in fiber, yarn and fabric morphology and structure. The fiber-based resistive flexible pressure, temperature and humidity discrete sensing units with high sensitivity, fast response rate, stable performance and anti-interference in a wide stimulation interval are prepared. The structural evolution processes and resistance change laws of conductive materials and their pathways are revealed. A new method of weaving and integrating multiple discrete sensing units, signal acquisition electrodes and signal lines into a fiber-based flexible electronic skin which has the capability of realizing multiple sensing functions in a large area, as wells as the three-dimensional flexibility and comfort, is designed. In addition, the transmission mechanism, distribution law and anti-interference mechanism of complex stresses, temperature and humidity stimuli in each discrete sensor unit are clarified. The relationship between the structure and performance of multi-functional fiber-based flexible electronic skin is established. Furthermore, the cooperative mechanism and working mechanism of multiple discrete sensor units are proposed. This project will shed new lights on the research of high-performance flexible electronic skin, and provide both theoretical and technical supports for its mass production and wide applications.