相比半导体射频开关，RF MEMS开关具有低功耗、低插耗和高隔离度等优异特性，在相控阵雷达、无线通讯以及卫星通讯等领域具有广泛的应用前景，但目前亟待在可靠性方面取得突破。而吸合冲击碰撞造成的接触磨损、绝缘层损伤是制约上述性能指标的主要因素之一。本项目利用HOPG（Highly Oriented Pyrolytic Graphite）片与绝缘层间近零摩擦（μ<0.001）、无磨损的结构超滑特性，设计一种无冲击水平滑动式RF MEMS静电电容开关。由于利用HOPG片与绝缘层间的水平滑动实现射频信号切换，新型超滑开关可从根本上避免吸合冲击现象。项目将具体研究基于结构超滑的开关驱动结构设计原理，构建开关系统的集总参数动力学物理模型和有限元仿真优化模型，探究HOPG片位移的精确、稳定控制方法，并开发适应结构超滑特点的微纳器件整体集成工艺，制备出原型器件，最后测试并评价其综合性能。

Compared with traditional semiconductor RF switches, RF MEMS switches have broad application prospects in many fields such as multi-function array radar, next-generation wireless communication and satellite communication system, due to the advantages of low power consumption, low insertion loss and high isolation. However, there is an urgent need to make a breakthrough in device reliability, and the previous studies show contact wear and dielectric damage caused by impact at closure are one of the main factors restricting the reliability. For those problems, the present program proposes an entirely new method that using the structural superlubric features of virtually zero friction (μ <0.001) and wear-free between HOPG (Highly Oriented Pyrolytic Graphite) mesa and dielectric layer to design a horizontal sliding RF MEMS electrostatic capacitance switch with no impact effect. Because of operating on-off state by horizontal contact sliding between HOPG mesa and dielectric layer, the superlubric RF MEMS switch can fundamentally avoid the impact effect at closure. In the present project, the design principle of the actuation configuration for superlubric RF MEMS switch will be studied in detail. A lumped parameter dynamic physical model and finite element simulation optimization model of the switching system will be constructed and analyzed, and they will be used to research the precise and stable displacement control strategy of HOPG mesa. The corresponding micro/nano integrated fabrication processes for superlubric RF MEMS switches will be developed to complete the switch prototypes, Finally, the fabricated superlubric RF MEMS switches will be tested and characterized for evaluating its overall performance.