本项目针对电子产品微型化的趋势，提出可穿戴电子产品钎料各项异性导电胶薄膜(钎料-ACF)的柔性互连研究，键合后焊点只有10um大小，通常只存在一个Sn晶粒，电流密度很容易达到10的4次方安培每平方厘米以上，电迁移可靠性成为是一个非常重要的问题。可是钎料-ACF键合后受树脂回弹的影响，焊点内存在大量裂纹，阻碍了恒温老化和电迁移的研究。本项目拟通过优化超声波键合工艺和添加微米的绝缘颗粒控制焊点形貌，避免上下电极发生接触和短路。研究完整的Sn晶粒在恒温老化和电迁移下的影响，揭示等温时效与电迁移对钎料-ACF界面反应的作用机理，阐明不同晶粒取向的Sn在焦耳热和电子风力共同作用下界面IMC的生长动力学及失效模式，构建Mean-Time-To-Failure模型，预测钎料-ACF在可穿戴电子产品中的使用寿命。

In the miniaturization trend of the electronics, we proposed a study on the 10-um-size solder anisotropic conductive adhesive film (solder-ACF) joint for flexible interconnection. There usually is one Sn grain in the 10-um-size solder ACF joint, where current density easily reaches 10 above 4 power amp per square centimeters, so electromigration reliability becomes an important issue. However, solder ACF joints were always cracked by the polymer rebound after bonding precess, as a result, the isothermal aging and electromigraton experiments have not been carried out, due to solder cracks before reliability. In this study, we attempted to achieve a complete the solder joint without cracks before reliability, by optimizing ultrasonic bonding parameters and adding 10-um-size insulation particles, to void the short circuit between the top and bottom electrodes due to direct contact. We try to study a complete Sn grain in terms of isothermal aging and electromigration test, so the intermetallic compound growth kinetics and the failure mode were clarified by the effect of oriented Sn grains under joule heat and electron-wind-force in electromigration test. Finally, we build a Mean-Time-To-Failure model of oriented solder ACF joints to predict the electromigration life for wearable electronics.