针对PI薄膜-树脂-铜箔结合的HDI挠性板微导通孔（直径0.075-0.1mm）高速钻削中，孔壁钻污严重、孔壁烧伤、毛刺和排屑不畅等问题，在深入研究HDI挠性板微导通孔钻削机理、钻削热生成和孔内与板面温度场分布的基础上，提出钻污、毛刺形成的条件与钻削温度控制准则；研究钻孔前降低基材温度、钻孔过程中多种工艺方法降低钻削温度、提高散热效率和改善排屑的理论与工艺方法。项目将对HDI挠性板的钻削过程进行观察与分析，分析孔内钻污、毛刺形成机制；采用新型超微细热电偶测试技术，研究孔内热的生成与传导机制；建立钻孔温度场数值模型，研究温度场和整个挠性板多孔温度场的分布和变化规律；研究采用钻孔前低温冷冻板材、钻孔时低温冷风喷射和新型盖、垫板材料辅助散热的组合温度控制的理论、方法与工艺技术，并优化刀具螺旋角、刀具结构以及加工参数等。获得提高HDI挠性板微导通孔加工质量的系统理论和工艺技术，丰富复合材料切削加工理论。

To solve the hole problems such as smear on the hole wall surface, burned hole wall surface, burrs, and bad chip removal, the high speed micro-drilling (0.075-0.1 mm diameter) of HDI Flexible Printed Circuit Board (FPC) which is composed of thin film PI-resin-copper foil is studied. This project proposed to learn the mechanism of HDI FPC, the mechanism of heat generation, the distribution of the temperature field, the condition of smear and burr generation, and the control of drilling temperature. A new theory and process to reduce the drilling temperature, improve the heat transfer efficiency, and chip removal is proposed, which is cooling the FPC before drilling and during drilling process. Thus, the drilling process will be observed and analyzed. The mechanism of smear and burr generation will be analyzed. The heat generation and transfer mechanism will be investigated. The model of drilling temperature field will be established. The distribution and change rules of temperature field will be learned. The combination of three temperature control methods like refrigerated air jetting during drilling, board pre-cooling, and entry and back-up boards will be optimized. The geometry of tools and the drilling parameters will also be optimized. Finally, a theory system and process technology which can improve the hole quality of HDI FPC micro-through-holes drilling will be obtained, enriching the cutting theory and improving the machining quality of PCB.