基于多层压电陶瓷的高粘度流体3D打印关键技术及其多场耦合建模，涉及到机械设计、机构动力学、无机非金属材料、流体力学、振动力学等交叉学科。选择液态金属、纳米银、银浆、焊锡膏、生物医药制剂、感光胶、釉料墨水等不同介质时，该技术可用于电子封装、增材制造、3D打印、喷墨打印、线路印刷、医药检测、印染装饰等领域。因机理复杂、技术门槛高，市场被欧美等发达国家所垄断，诸多科学问题亟待解决：1）温度、力、流体等多场作用下高粘度微液滴形成机制；2）压电陶瓷、撞针、高粘度喷射介质和微喷嘴之间的机-电、液-固、液-气等多场耦合；3）结构优化设计解决喷射堵塞、挂胶、液滴重复精度低、低粘度液滴溅射等问题；4）压电陶瓷复合结构的非线性、多体动力学研究；5）微流场分布、纳升液滴飞行轨迹模拟与测试研究；6）微液滴射流技术的可靠性及实验研究。该研究有助于提升我国电子封装和数字印刷行业关键工艺设备的国产化及行业水平。

The key technology of the non-contact 3D printing technique of high viscosity liquid based-on piezostack and its multi-field coupling model will be investigated. The research involves multi-subjects, such as mechanical design, mechanical dynamics, inorganic non-metallic materials, fluid mechanics, mechanics of vibration, etc. According to different printing media of liquid metal, silver paste, nano silver, soldering paste tinol, biological medicine, UV photosensitive resist, glaze ink, etc., the jetting dispenser can be applied in the fields of electronic packaging, additive manufacturing, 3D printing, ink-printing, circuit printing, medical measurement, Printing and dyeing decoration, etc. In view of complicated mechanism, high market entrance standant, monopoly by Europe and the United States, there are still some issues to be resolved: 1) the formation mechanism of micro liquid droplet under multi-field of temperature, external force and liquid; 2) electromechanical coupling, liquid-solid couple, liquid-gas couple among the piezoelectric element, pin, high viscosity dispensing media, and.special-shaped micro nozzle; 3) the issues involving blockage of the nozzle, repeatability precision of the dispensing droplet, droplet departure from the nozzle, random sputtering of the low viscosity droplet, etc; 4) the nonlinear behavior of the piezostack compound structure and multibody dynamics; 5) the pressure distribution of the liquid flow field, and the forming principle of the nano-liter droplet; 6) reliability of the micro-droplet ejector and experimental research. The above research is helpful to the improvement and productive.nationalization of key technology equipment of the electronic packaging and digital printing industries in our country.